Chemical mechanical polishing pad
US-12491604-B2 · Dec 9, 2025 · US
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Qian Bainian patents
Qian Bainian is listed as an inventor on 77 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Qian Bainian |
| Total patents | 77 |
| First publication | Mar 5, 2015 |
| Latest publication | Dec 9, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Chemical mechanical planarization pad having polishing layer with multi-lobed embedded features
US-12447581-B2 · Oct 21, 2025 · US
Chemical mechanical polishing pad and preparation thereof
US-12220784-B2 · Feb 11, 2025 · US
Cmp polishing pad
US-2024091901-A1 · Mar 21, 2024 · US
Chemical Mechanical Planarization Pad Having Polishing Layer with Multi-lobed Embedded Features
US-2024009798-A1 · Jan 11, 2024 · US
Chemical mechanical polishing pads for improved removal rate and planarization
US-2023294240-A1 · Sep 21, 2023 · US
Chemical mechanical polishing pad and preparation thereof
US-11679531-B2 · Jun 20, 2023 · US
Chemical mechanical polishing pad and preparation thereof
US-2023112598-A1 · Apr 13, 2023 · US
Chemical mechanical polishing pad and preparation thereof
US-2023112228-A1 · Apr 13, 2023 · US
Cmp polishing pad
US-2023015668-A1 · Jan 19, 2023 · US
Recent patents
Latest publications not already listed above.
Methods of making chemical mechanical polishing layers having improved uniformity
US-11524390-B2 · Dec 13, 2022 · US
Chemical mechanical polishing pad
US-2022266416-A1 · Aug 25, 2022 · US
Chemical mechanical polishing pad
US-11396081-B2 · Jul 26, 2022 · US
Chemical mechanical polishing pad
US-10875144-B2 · Dec 29, 2020 · US
High removal rate chemical mechanical polishing pads and methods of making
US-10722999-B2 · Jul 28, 2020 · US
Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US-10625393-B2 · Apr 21, 2020 · US
High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
US-10464187-B2 · Nov 5, 2019 · US
Chemical mechanical polishing pad
US-2019308294-A1 · Oct 10, 2019 · US
Chemical mechanical polishing pads for improved removal rate and planarization
US-10391606-B2 · Aug 27, 2019 · US
High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives
US-2019168356-A1 · Jun 6, 2019 · US
Chemical mechanical polishing pad
US-2018361531-A1 · Dec 20, 2018 · US
Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity
US-2018354094-A1 · Dec 13, 2018 · US
Chemical mechanical polishing pads for improved removal rate and planarization
US-2018345449-A1 · Dec 6, 2018 · US
Chemical mechanical polishing pads for improved removal rate and planarization
US-2018345448-A1 · Dec 6, 2018 · US
Method of making polishing layer for chemical mechanical polishing pad
US-10144115-B2 · Dec 4, 2018 · US
Methods of making chemical mechanical polishing layers having improved uniformity
US-2018311792-A1 · Nov 1, 2018 · US
Method of making polishing layer for chemical mechanical polishing pad
US-10105825-B2 · Oct 23, 2018 · US
Method of making composite polishing layer for chemical mechanical polishing pad
US-10092998-B2 · Oct 9, 2018 · US
Chemical mechanical polishing pad
US-2018281149-A1 · Oct 4, 2018 · US
Method of making composite polishing layer for chemical mechanical polishing pad
US-10011002-B2 · Jul 3, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Dow Global Technologies Llc | 54 |
| Rohm & Haas Elect Materials Cmp Holdings Inc | 52 |
| Rohm & Haas Elect Mat | 25 |
| Dupont Electronics Inc | 4 |
| Nitta Haas Inc | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B24B37/24 | 69 |
| H10P52/402 | 37 |
| B24B37/22 | 34 |
| H01L21/30625 | 30 |
| H10P52/00 | 22 |