Cmp polishing pad

Patent metadata

Field	Value
Publication number	US-2024091901-A1
Application number	US-202318503445-A
Country	US
Kind code	A1
Filing date	Nov 7, 2023
Priority date	Jul 1, 2021
Publication date	Mar 21, 2024
Grant date	—

Abstract

A polishing pad has a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements. The microelements can be expanded, hollow microelements. The microelements can have a specific gravity measured of 0.01 to 0.2. The microelements can have a volume averaged particle size of 1 to 120 or 15 to 30 micrometers. The polishing layer is chlorine free.

First claim

What is claimed is:

1 . A polishing pad useful in chemical mechanical polishing having a polishing layer comprising:
a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent; and chlorine-free microelements having a specific gravity of 0.05 to 0.1 distributed within the polymer matrix.

2 . The polishing pad of claim 1 wherein the polishing layer has a chlorine content less than 0.1 wt % based on total weight of the polishing layer as determined by energy-dispersive X-ray spectroscopy.

3 . The polishing pad of claim 1 wherein the chlorine-free aromatic polyamine cure agent is an aromatic diamine.

4 . The polishing pad of claim 3 wherein the aromatic diamine has the formula

where either R 1 and R 3 or R 1 and R 4 are amine groups or alkyl amine groups having 1 to 5 carbon atoms and R 2 , R 5 , R 6 , and whichever of R 3 or R 4 does not contain an amine containing group are independently selected in each occurrence from H, -L-alkyl groups of 1-4, carbon atoms, where L is a direct bond, or a linking group selected from O or S.

5 . The polishing pad of claim 1 wherein the chlorine-free aromatic polyamine cure agent comprises diethyl toluene diamine (DETDA), dimethyl thio-toluene diamine (DMTDA), or a combination thereof.

6 . The polishing pad of claim 1 wherein the chlorine-free microelements have a shell comprising an acrylonitrile copolymer.

7 . The polishing pad of claim 1 wherein the polishing layer comprises the chlorine-free microelements in an amount of 5 to 50 percent by volume based on total volume of the polishing layer portion.

8 . The polishing pad of claim 1 wherein the microelement has a volume averaged particle size of 15 to 30 micrometers.

9 . The polishing pad of claim 1 wherein the chlorine-free microelements have a wall thickness of 30 to 300 nanometers.

10 . A polishing pad useful in chemical mechanical polishing having a polishing layer comprising a polymer matrix comprising the reaction product of an isocyanate terminated urethane prepolymer and a chlorine-free aromatic polyamine cure agent and chlorine-free microelements distributed within the polymer matrix wherein the polishing layer has a chlorine content less than 0.01 wt % based on total weight of the polishing layer as determined by Combustion Ion Chromatography (CIC) as set out in ASTM D7359-18, wherein the chlorine-free microelements having a volume averaged particle size of 15 to 30 micrometers and an average shell wall thickness of 30 to 300 nanometers.

Assignees

• Rohm & Haas Elect Materials Cmp Holdings Inc

Inventors

• Qian Bainian
• Alden Donna M
• Cimoch Matthew
• Chiou Nan-Rong
• Tseng Sheng-Huan

Classifications

• B24B37/24 Primary

  characterised by the composition or properties of the pad materials · CPC title

• B24D3/28

  Resins {or natural or synthetic macromolecular compounds (B24D3/22 takes precedence)} · CPC title

• B24D3/30

  for close-grained structure · CPC title

• B24D3/32

  for porous or cellular structure · CPC title

• B24B37/22 Primary

  characterised by a multi-layered structure · CPC title