Chemical mechanical polishing pad and preparation thereof
US-11679531-B2 · Jun 20, 2023 · US
Chemical mechanical polishing pad and preparation thereof
US12220784B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12220784-B2 |
| Application number | US-202117500630-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 13, 2021 |
| Priority date | Oct 13, 2021 |
| Publication date | Feb 11, 2025 |
| Grant date | Feb 11, 2025 |
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- Title
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- Abstract
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Abstract
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The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is a photopolymerizable composition containing a block copolymer, a UV curable acrylate, and a photoinitiator.
First claim
Opening claim text (preview).
We claim: 1. A chemical mechanical polishing pad suitable for polishing at least one of a semiconductor substrate, an optical substrate and a magnetic substrate, the polishing pad having a polishing layer, the polishing layer being cured from an extruded sheet, the extruded sheet comprising a photopolymerizable composition comprising a styrenic block copolymer, a UV curable acrylate, polybutadiene oil and a photoinitiator, wherein said styrenic block copolymer is one or more members selected from the group consisting of a styrene-butadiene styrene (SBS) block copolymer, a styrene-isoprene-styrene (SIS) block copolymer, a styrene-ethylene-butene-styrene (SEBS) block copolymer a styrene-ethylene-propylene-styrene (SEPS) block copolymer, and mixtures thereof and the styrenic block copolymer is present at an amount of greater than 50 wt %, based on the total weight of the extruded sheet, and wherein upon UV curing, the extruded sheet having a Shore D hardness in the range of 40 to 70. 2. The chemical mechanical polishing pad of claim 1 , wherein said photopolymerizable composition further comprising an oil. 3. The chemical mechanical polishing pad of claim 1 , wherein said styrenic block copolymer is a triblock copolymer. 4. The chemical mechanical polishing pad of claim 1 , wherein said styrenic block copolymer is present at an amount of greater than 65%. 5. The chemical mechanical polishing pad of claim 1 , wherein said acrylate is one or more members selected from the group consisting of 1,3-butylene glycol diacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol diacrylate, and mixtures thereof. 6. The chemical mechanical polishing pad of claim 1 , wherein the extruded sheet after UV curing having a Shore D hardness in the range of 45 to 55. 7. The chemical mechanical polishing pad of claim 1 , wherein said photopolymerizable composition does not contain any organic solvent. 8. The chemical mechanical polishing pad of claim 1 , wherein said photopolymerizable composition further comprising a plasticizer.
Assignees
Inventors
Classifications
of semiconductor materials · CPC title
- B24B37/24Primary
characterised by the composition or properties of the pad materials · CPC title
- B24B37/26Primary
characterised by the shape of the lapping pad surface, e.g. grooved · CPC title
Resins {or natural or synthetic macromolecular compounds (B24D3/22 takes precedence)} · CPC title
Compositions of oils, fats or waxes; Compositions of derivatives thereof · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12220784B2 cover?
- The present invention concerns a chemical mechanical polishing pad having a polishing layer. The polishing layer contains an extruded sheet. The extruded sheet is a photopolymerizable composition containing a block copolymer, a UV curable acrylate, and a photoinitiator.
- Who is the assignee on this patent?
- Rohm & Haas Elect Materials Cmp Holdings Inc, Dupont Electronics Inc
- What technology area does this patent fall under?
- Primary CPC classification B24B37/24. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Feb 11 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).