Chemical mechanical polishing pad

Patent metadata

Field	Value
Publication number	US-2022266416-A1
Application number	US-202217661611-A
Country	US
Kind code	A1
Filing date	May 2, 2022
Priority date	Apr 25, 2014
Publication date	Aug 25, 2022
Grant date	—

Abstract

A chemical mechanical polishing pad is provided containing a polishing layer having a polishing surface, wherein the polishing layer comprises a reaction product of ingredients, including: an isocyanate terminated urethane prepolymer; and, a curative system, containing a high molecular weight polyol curative; and, a difunctional curative.

First claim

We claim:

1 . A chemical mechanical polishing pad adapted for polishing a substrate selected from the group consisting of at least one of a magnetic substrate, an optical substrate and a semiconductor substrate, comprising:
a polishing layer adapted for polishing a substrate selected from the group consisting of at least one of a magnetic substrate, an optical substrate and a semiconductor substrate having a polishing surface, wherein the polishing layer comprises a reaction product of ingredients, comprising:
an isocyanate terminated urethane prepolymer having 8.75 to 9.25 wt% unreacted NCO groups; and,
a curative system consisting essentially of:
20 to 60 wt% of a high molecular weight polyol curative, wherein the high molecular weight polyol curative has a number average molecular weight, M N , of 10,000 to 12,000; and wherein the high molecular weight polyol curative has an average of 6 hydroxyl groups per molecule; and,
40 to 80 wt% of a difunctional curative wherein the polishing layer exhibits a density of greater than 0.6 g/cm 3 .

2 . The chemical mechanical polishing pad of claim 1 , wherein the curative system has a plurality of reactive hydrogen groups and the isocyanate terminated urethane prepolymer has a plurality of unreacted NCO groups; and wherein a stoichiometric ratio of the reactive hydrogen groups to the unreacted NCO groups is 0.85 to 1.15.

3 . The chemical mechanical polishing pad of claim 1 , wherein the isocyanate terminated urethane prepolymer has 8.95 to 9.25 unreacted NCO groups.

4 . The chemical mechanical polishing pad of claim 1 , wherein the polishing surface has a groove pattern formed therein.

5 . The chemical mechanical polishing pad of claim 1 , wherein the M N of the high molecular weight polyol curative is about 11,400.

Assignees

• Rohm & Haas Elect Materials Cmp Holdings Inc
• Dow Global Technologies Llc

Inventors

• Qian Bainian
• Degroot Marty W

Classifications

• H10P95/062

  involving a dielectric removal step · CPC title

• H10P52/402

  of semiconductor materials · CPC title

• B24B37/24 Primary

  characterised by the composition or properties of the pad materials · CPC title

• H01L21/31053

  Electricity · mapped topic

• H01L21/30625

  Electricity · mapped topic