Control of wafer bow during integrated circuit processing
US-2023136819-A1 · May 4, 2023 · US
This page is not indexed by search engines while we improve data quality.
Porter David W patents
Porter David W is listed as an inventor on 60 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Porter David W |
| Total patents | 60 |
| First publication | Feb 24, 2015 |
| Latest publication | May 4, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Electroplating apparatus for tailored uniformity profile
US-11549192-B2 · Jan 10, 2023 · US
Abnormal tissue detection via modal upstream data fusion
US-11361868-B2 · Jun 14, 2022 · US
Electroplating apparatus for tailored uniformity profile
US-2021148001-A1 · May 20, 2021 · US
Selective deposition with atomic layer etch reset
US-10998187-B2 · May 4, 2021 · US
Protecting anodes from passivation in alloy plating systems
US-10954605-B2 · Mar 23, 2021 · US
Electroplating apparatus for tailored uniformity profile
US-10920335-B2 · Feb 16, 2021 · US
Wetting pretreatment for enhanced damascene metal filling
US-10840101-B2 · Nov 17, 2020 · US
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US-10662545-B2 · May 26, 2020 · US
Selective deposition with atomic layer etch reset
US-2020118809-A1 · Apr 16, 2020 · US
Recent patents
Latest publications not already listed above.
Selective deposition with atomic layer etch reset
US-10559461-B2 · Feb 11, 2020 · US
TSV bath evaluation using field versus feature contrast
US-10508359-B2 · Dec 17, 2019 · US
Electroplating apparatus and process for wafer level packaging
US-10309024-B2 · Jun 4, 2019 · US
Abnormal Tissue Detection Via Modal Upstream Data Fusion
US-2019057778-A1 · Feb 21, 2019 · US
Bubble and foam solutions using a completely immersed air-free feedback flow control valve
US-10208395-B2 · Feb 19, 2019 · US
Protecting anodes from passivation in alloy plating systems
US-2018371637-A1 · Dec 27, 2018 · US
Method and apparatus for remote plasma treatment for reducing metal oxides on a metal seed layer
US-2018350670-A1 · Dec 6, 2018 · US
Selective deposition with atomic layer etch reset
US-2018308680-A1 · Oct 25, 2018 · US
Protecting anodes from passivation in alloy plating systems
US-10106907-B2 · Oct 23, 2018 · US
Electroplating apparatus for tailored uniformity profile
US-2018291517-A1 · Oct 11, 2018 · US
Electroplating apparatus and process for wafer level packaging
US-2018237933-A1 · Aug 23, 2018 · US
Dynamic current distribution control apparatus and method for wafer electroplating
US-10023970-B2 · Jul 17, 2018 · US
Electroplating apparatus for tailored uniformity profile
US-10017869-B2 · Jul 10, 2018 · US
Electroplating apparatus and process for wafer level packaging
US-9982357-B2 · May 29, 2018 · US
Wetting pretreatment for enhanced damascene metal filling
US-2018138044-A1 · May 17, 2018 · US
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US-2018105949-A1 · Apr 19, 2018 · US
Dynamic current distribution control apparatus and method for wafer electroplating
US-2018057955-A1 · Mar 1, 2018 · US
Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte
US-2018030611-A1 · Feb 1, 2018 · US
Wetting pretreatment for enhanced damascene metal filling
US-9852913-B2 · Dec 26, 2017 · US
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US-9834852-B2 · Dec 5, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Novellus Systems Inc | 46 |
| Lam Res Corp | 12 |
| Porter David W | 3 |
| Univ Johns Hopkins | 2 |
| Mayer Steven T | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 48 |
| C25D21/12 | 37 |
| C25D7/123 | 36 |
| C25D17/002 | 34 |
| C25D17/008 | 18 |