Selective deposition with atomic layer etch reset

Patent metadata

Field	Value
Publication number	US-10559461-B2
Application number	US-201715581951-A
Country	US
Kind code	B2
Filing date	Apr 28, 2017
Priority date	Apr 19, 2017
Publication date	Feb 11, 2020
Grant date	Feb 11, 2020

Abstract

Methods are provided for conducting a deposition on a semiconductor substrate by selectively depositing a material on the substrate. The substrate has a plurality of substrate materials, each with a different nucleation delay corresponding to the material deposited thereon. Specifically, the nucleation delay associated with a first substrate material on which deposition is intended is less than the nucleation delay associated with a second substrate material on which deposition is not intended according to a nucleation delay differential, which degrades as deposition proceeds. A portion of the deposited material is etched to reestablish the nucleation delay differential between the first and the second substrate materials. The material is further selectively deposited on the substrate.

First claim

What is claimed is:

1. A method comprising:
(a) exposing a substrate housed in a chamber to alternating pulses of a first reactant and a second reactant to deposit a film over the substrate, the substrate having a first substrate material on which deposition of the film is intended and a second substrate material on which deposition of the film is not intended, the second substrate material being different from the first substrate material, and a nucleation delay for the first substrate material being less than a nucleation delay for the second substrate material according to a nucleation delay differential, which degrades upon proceeding with the film deposition; and
(b) exposing the substrate housed in the chamber to alternating pulses of an etching gas and a removal gas to etch a portion of the film deposited in (a) to reset the nucleation delay differential between the first and second substrate materials;
wherein (a) and (b) result in net deposition of the film on the first substrate material.

2. The method of claim 1 further comprising repeating (a) and (b) in the same chamber.

3. The method of claim 1 , wherein the first reactant is a deposition precursor to modify a surface of the substrate, the second reactant is a reducing agent to deposit the material.

4. The method of claim 1 , wherein the material to be deposited is aluminum nitride (AlN).

5. The method of claim 1 , wherein the plurality of substrate materials are selected from a group consisting of silicon oxide (SiO 2 ), silicon nitride (Si 3 N 4 ), silicon carbide (SiC), aluminum oxide (Al 2 O 3 ), and aluminum nitride (AlN).

6. The method of claim 4 , wherein trimethylaluminum provides aluminum for the aluminum nitride to be deposited.

7. The method of claim 1 , wherein (a) and (b) are performed without breaking vacuum.

Assignees

• Lam Res Corp

Inventors

• Reddy Kapu Sirish
• Rainville Meliha Gozde
• Shankar Nagraj
• Hausmann Dennis M
• Smith David Charles
• Sivaramakrishnan Karthik
• Porter David W

Classifications

• H10P72/0466

  characterised by the construction of the load-lock chamber · CPC title

• H10P72/0454

  surrounding a central transfer chamber · CPC title

• H10P50/285

  of materials not containing Si, e.g. PZT or Al2O3 · CPC title

• H10P14/69391

  the material containing aluminium, e.g. Al2O3 · CPC title

• H10P14/6339 Primary

  deposition by cyclic CVD, e.g. ALD, ALE or pulsed CVD · CPC title