Bubble and foam solutions using a completely immersed air-free feedback flow control valve

Patent metadata

Field	Value
Publication number	US-10208395-B2
Application number	US-201715442519-A
Country	US
Kind code	B2
Filing date	Feb 24, 2017
Priority date	Dec 11, 2012
Publication date	Feb 19, 2019
Grant date	Feb 19, 2019

Abstract

The embodiments disclosed herein relate to methods and apparatus for promoting bubble-free circulation of processing fluids in a recirculation system. Certain disclosed techniques involve passive, mechanical valve designs that promote variable resistance to flow in a drain. Other techniques involve automated flow control schemes that utilize feedback from flow meters, level sensors, etc. to achieve a balanced and bubble-free flow. The disclosed embodiments greatly reduce the incorporation of gas into a processing fluid, in particular as the processing fluid returns from a processing cell to a reservoir.

First claim

What is claimed is:

1. An apparatus for electroplating material onto a substrate, comprising:
an electroplating cell comprising:
a vessel for holding electrolyte;
a weir wall positioned at the periphery of the vessel; and
a fluid collection trough substantially surrounding the weir wall, such that during electroplating, electrolyte flows into the vessel, over the weir wall and into the fluid collection trough;

an electrolyte reservoir;
a return conduit for delivering electrolyte from the fluid collection trough to the electrolyte reservoir;
a plating recirculation loop comprising the electrolyte reservoir, a pump, the electroplating cell and the return conduit;
an electrolyte meter for sensing a level of fluid in the fluid collection trough;
a drain valve positioned in the return conduit; and
a drain controller configured to control a position of the drain valve based on the level of fluid in the fluid collection trough received from the electrolyte meter, wherein the drain controller is configured to cause the level of fluid in the fluid collection trough to remain above a target electrolyte level to thereby ensure that no gas enters the return conduit during electroplating.

2. The apparatus of claim 1 , wherein the electrolyte meter comprises an acoustic echo type sensor.

3. The apparatus of claim 2 , wherein the acoustic echo type sensor directly senses the level of fluid in the fluid collection trough.

4. The apparatus of claim 2 , wherein the acoustic echo type sensor senses the level of fluid in the fluid collection trough via a sight tube connected in parallel to the fluid collection trough.

5. The apparatus of claim 1 , wherein the electrolyte meter comprises a capacitive strip sensor.

6. The apparatus of claim 1 , wherein the electrolyte meter comprises a pressure transducer sensor.

7. The apparatus of claim 6 , wherein the pressure transducer sensor measures a pressure head of electrolyte in a region about 2-7 inches below the vessel.

8. The apparatus of claim 1 , wherein a drop distance between the level of fluid in the fluid collection trough and a fluid level in the electrolyte reservoir is at least about 5 feet.

9. The apparatus of claim 1 , further comprising an overflow sensor and a flow controller, wherein the overflow sensor detects overflow within the electroplating cell, and wherein the flow controller is configured to shut off the pump in response to a signal from the overflow sensor.

10. The apparatus of claim 1 , further comprising a drain isolation valve positioned in the return conduit, wherein the drain valve and the drain isolation valve are two separate valves.

11. The apparatus of claim 1 , further comprising an additional electroplating cell, wherein the return conduit comprises a first inlet for receiving electrolyte from the electroplating cell and a second inlet for receiving electrolyte from the additional electroplating cell.

12. The apparatus of claim 1 , wherein an outlet of the return conduit is positioned below a level of electrolyte in the electrolyte reservoir.

13. The apparatus of claim 1 , wherein the plating recirculation loop further comprises a filter, a flow meter, and a degasser.

Assignees

• Lam Res Corp

Inventors

• Abraham Richard
• Rash Robert
• Porter David W
• Mayer Steven T
• Ostrowski John

Classifications

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D21/12 Primary

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D21/04 Primary

  Removal of gases or vapours {; Gas or pressure control} · CPC title

• C25D17/008

  Current shielding devices · CPC title

• C25D17/00

  Constructional parts, or assemblies thereof, of cells for electrolytic coating · CPC title