Protecting anodes from passivation in alloy plating systems

Patent metadata

Field	Value
Publication number	US-10106907-B2
Application number	US-201615360757-A
Country	US
Kind code	B2
Filing date	Nov 23, 2016
Priority date	Jun 5, 2012
Publication date	Oct 23, 2018
Grant date	Oct 23, 2018

Abstract

An apparatus for continuous simultaneous electroplating of two metals having substantially different standard electrodeposition potentials (e.g., for deposition of Sn—Ag alloys) comprises an anode chamber for containing an anolyte comprising ions of a first, less noble metal, (e.g., tin), but not of a second, more noble, metal (e.g., silver) and an active anode; a cathode chamber for containing catholyte including ions of a first metal (e.g., tin), ions of a second, more noble, metal (e.g., silver), and the substrate; a separation structure positioned between the anode chamber and the cathode chamber, where the separation structure substantially prevents transfer of more noble metal from catholyte to the anolyte; and fluidic features and an associated controller coupled to the apparatus and configured to perform continuous electroplating, while maintaining substantially constant concentrations of plating bath components for extended periods of use.

First claim

What is claimed is:

1. A method of simultaneous electroplating of a first metal and of a second, more noble metal on a substrate, the method comprising:
(a) flowing anolyte through an anode chamber containing an active anode, the active anode comprising the first metal;
(b) flowing catholyte through a cathode chamber containing the substrate, wherein the anode chamber is separated from the cathode chamber by a separation structure that permits passage of ionic current during electroplating; and
(c) contacting the anolyte with a getter comprising a solid phase getter material that undergoes a metal-metal displacement reaction or a selective ion exchange process when contacting ions of the second metal, wherein the getter is positioned to contact the anolyte but not contact the catholyte during electroplating,
wherein the getter is positioned at a first distance from the cathode chamber and the active anode is positioned at a second distance from the cathode chamber, such that the first distance is greater than the second distance, and
wherein the getter is structurally distinct from the active anode.

2. The method of claim 1 , wherein the first metal is tin and the second metal is silver.

3. The method of claim 2 , further comprising delivering silver ions to the catholyte.

4. The method of claim 1 , wherein the active anode comprises low alpha tin.

5. The method of claim 1 , wherein the separation structure comprises an ion selective membrane.

6. The method of claim 1 , wherein flowing the anolyte through the anode chamber comprises flowing the anolyte through an anolyte circulation loop fluidically coupled to the anode chamber, and
wherein the getter is disposed in the anolyte circulation loop.

7. The method of claim 6 , further comprising flowing current through a circuit connecting the getter material and the active anode while contacting the anolyte with the getter.

8. The method of claim 6 , wherein said getter comprises a filter having a wound structure comprising the getter material, and wherein the anolyte flows through the wound structure.

9. The method of claim 1 , wherein the getter material comprises low alpha tin metal.

10. The method of claim 1 , wherein the getter is electrically isolated from the active anode.

11. The method of claim 1 , wherein the getter material comprises particles with a surface area to volume ratio of at least about two times the surface area to volume ratio of the active anode material.

12. The method of claim 1 , wherein the getter comprises a metal that is different from the metal of the active anode, and that is less noble than both the first metal and the second metal.

13. The method of claim 1 , wherein the first metal is tin, the second metal is silver and the getter comprises a metal that is less noble than both tin and silver.

14. The method of claim 1 , wherein the first metal is tin, the second metal is silver and the getter comprises nickel.

15. The method of claim 1 , wherein the first metal is tin, the second metal is silver and the getter comprises indium.

16. The method of claim 1 , wherein the first metal is tin, the second metal is silver and the getter comprises cobalt.

17. The method of claim 1 , wherein the first metal is tin, the second metal is silver and the getter comprises tin.

18. The method of claim 1 , wherein the getter comprises an ion-selective ion-exchange resin.

19. The method of claim 1 , wherein the first metal is tin, the second metal is silver, and the getter comprises tin sulfide.

Assignees

• Novellus Systems Inc

Inventors

• Chua Lee Peng
• Mayer Steven T
• Porter David W
• Ponnuswamy Thomas A

Classifications

• C25D21/18 Primary

  of electrolytes (C25D21/22 takes precedence) · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• C25D3/60

  containing more than 50% by weight of tin · CPC title

• C25D5/00

  Electroplating characterised by the process; Pretreatment or after-treatment of workpieces · CPC title