Electroplating apparatus for tailored uniformity profile

Patent metadata

Field	Value
Publication number	US-10017869-B2
Application number	US-201614987170-A
Country	US
Kind code	B2
Filing date	Jan 4, 2016
Priority date	Nov 7, 2008
Publication date	Jul 10, 2018
Grant date	Jul 10, 2018

Abstract

Methods of electroplating metal on a substrate while controlling azimuthal uniformity, include, in one aspect, providing the substrate to the electroplating apparatus configured for rotating the substrate during electroplating, and electroplating the metal on the substrate while rotating the substrate relative to a shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular (azimuthal) position. For example, a semiconductor wafer substrate can be rotated during electroplating slower or faster, when the selected portion of the substrate passes through the shielded area.

First claim

The invention claimed is:

1. A method of electroplating a metal on a cathodically biased substrate while controlling azimuthal uniformity, the method comprising:
(a) providing the substrate into an electroplating apparatus configured for rotating the substrate during electroplating, wherein the apparatus comprises an anode and a stationary auxiliary azimuthally asymmetric cathode; and
(b) electroplating the metal on the substrate while rotating the substrate, and while providing power to the auxiliary azimuthally asymmetric cathode in correlation with the rotation of the substrate, such that the auxiliary azimuthally asymmetric cathode diverts plating current from a first portion of the substrate at a selected azimuthal position of the substrate differently than from a second portion of the substrate having the same average arc length and the same average radial position and residing at a different azimuthal angular position.

2. The method of claim 1 , wherein the auxiliary azimuthally asymmetric cathode is C-shaped.

3. The method of claim 1 , wherein the auxiliary azimuthally asymmetric cathode is in an azimuthal current flow confinement structure.

4. The method of claim 1 , wherein the auxiliary azimuthally asymmetric cathode is housed in a separate chamber and the exposure of plating current to the auxiliary cathode is through at least one channel that diverts current into a region of the cell near the periphery of the substrate over an arc angle of less than about 120 degrees.

5. The method of claim 1 , wherein the stationary azimuthally asymmetric cathode is separated from the substrate by an ionically permeable membrane.

6. The method of claim 1 , wherein the stationary azimuthally asymmetric cathode is a copper cathode.

7. The method of claim 1 , wherein (b) comprises aligning the selected azimuthal position of the substrate with the stationary azimuthally asymmetric cathode during electroplating, and providing a selected current to the stationary azimuthally asymmetric cathode at a time of the alignment.

8. The method of claim 1 , wherein (b) comprises providing alternating levels of current to the stationary azimuthally asymmetric cathode during electroplating.

9. The method of claim 1 , wherein the stationary azimuthally asymmetric cathode and the substrate are located in a same plating chamber.

10. The method of claim 1 , wherein the substrate is non-circular.

11. The method of claim 1 , wherein the substrate is asymmetrical.

12. A method of electroplating a metal on a substrate while controlling azimuthal uniformity, the method comprising:
(a) providing the substrate into an electroplating apparatus configured for rotating the substrate during electroplating, wherein the electroplating apparatus comprises a shield, configured for providing azimuthally asymmetric shielding, wherein the shield has variable thickness; and
(b) electroplating the metal on the substrate while rotating the substrate relative to the shield such that a selected portion of the substrate at a selected azimuthal position dwells in a shielded area for a different amount of time than a second portion of the substrate having the same average arc length and the same average radial position and residing at a different angular azimuthal position.

13. The method of claim 12 , wherein the shield is tapered in thickness.

14. The method of claim 12 , wherein the shield has a central portion and an outer portion, wherein the shield is thinner in the central portion than in the outer portion.

15. The method of claim 12 , wherein the shield is tapered in thickness and wherein the thickness of the shield increases toward an outer portion of the shield.

16. The method of claim 12 , wherein the shield is an annular shield having an irregular portion.

17. The method of claim 12 , wherein the shield is an annular shield having an irregular portion, wherein the irregular portion is tapered.

18. The method of claim 12 , wherein (b) comprises rotating the substrate at a variable speed.

19. The method of claim 12 , wherein (b) comprises rotating the substrate bidirectionally.

Assignees

• Novellus Systems Inc

Inventors

• Mayer Steven T
• Porter David W
• Buckalew Bryan L
• Rash Robert

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W20/043

  for electroplating · CPC title

• C25D17/007

  Current directing devices · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/12

  Shape or form (C25D17/14 takes precedence) · CPC title