Wafer-level package sensor device
US-12499343-B2 · Dec 16, 2025 · US
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Pavier Mark patents
Pavier Mark is listed as an inventor on 44 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Pavier Mark |
| Total patents | 44 |
| First publication | Jan 1, 2015 |
| Latest publication | Dec 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Package with carrier having component accommodation volume on one side and repelling structure on other side
US-2025279324-A1 · Sep 4, 2025 · US
Embedded chip-package, semiconductor package, method of forming an embedded chip-package, method of forming a semiconductor package, and method of analyzing an embedded chip-package or a semiconductor package
US-2025079330-A1 · Mar 6, 2025 · US
Semiconductor die shielding structure
US-2024413094-A1 · Dec 12, 2024 · US
Method for Fabricating a Semiconductor Device
US-2024404983-A1 · Dec 5, 2024 · US
Package for an optical radiation device
US-2024288363-A1 · Aug 29, 2024 · US
Semiconductor die being connected with a clip and a wire which is partially disposed under the clip
US-12068274-B2 · Aug 20, 2024 · US
Methods of environmental protection for silicon MEMS structures in cavity packages
US-12063474-B2 · Aug 13, 2024 · US
Three level interconnect clip
US-12057376-B2 · Aug 6, 2024 · US
Semiconductor package including a high voltage semiconductor die and a gate driver semiconductor die, and method of producing the semiconductor package
US-2024203836-A1 · Jun 20, 2024 · US
Recent patents
Latest publications not already listed above.
Wafer-level package sensor device
US-2024202485-A1 · Jun 20, 2024 · US
Semiconductor die shielding structure
US-2024145402-A1 · May 2, 2024 · US
Semiconductor device, battery management system and method of producing a semiconductor device
US-2024030502-A1 · Jan 25, 2024 · US
Emitter package for a photoacoustic sensor
US-11609180-B2 · Mar 21, 2023 · US
Methods of environmental protection for silicon mems structures in cavity packages
US-2022369042-A1 · Nov 17, 2022 · US
Semiconductor assembly with conductive frame for I/O standoff and thermal dissipation
US-11393743-B2 · Jul 19, 2022 · US
Three Level Interconnect Clip
US-2022139811-A1 · May 5, 2022 · US
Semiconductor Assembly with Conductive Frame for I/O Standoff and Thermal Dissipation
US-2021193560-A1 · Jun 24, 2021 · US
Emitter Package for a Photoacoustic Sensor
US-2021172862-A1 · Jun 10, 2021 · US
Semiconductor Die being Connected with a Clip and a Wire which is Partially Disposed Under the Clip
US-2021175200-A1 · Jun 10, 2021 · US
Molded package with chip carrier comprising brazed electrically conductive layers
US-10283432-B2 · May 7, 2019 · US
Molded package with chip carrier comprising brazed electrically conductive layers
US-2019006260-A1 · Jan 3, 2019 · US
Semiconductor package including a semiconductor die having redistributed pads
US-2018366380-A1 · Dec 20, 2018 · US
Semiconductor package including a semiconductor die having redistributed pads
US-10103076-B2 · Oct 16, 2018 · US
Molded package with chip carrier comprising brazed electrically conductive layers
US-10074590-B1 · Sep 11, 2018 · US
Method for fabricating a semiconductor package with conductive carrier integrated heat spreader
US-9673109-B2 · Jun 6, 2017 · US
Semiconductor package including a semiconductor die having redistributed pads
US-2017148692-A1 · May 25, 2017 · US
Semiconductor package including a semiconductor die having redistributed pads
US-9633951-B2 · Apr 25, 2017 · US
Semiconductor package including conductive carrier coupled power switches
US-9576887-B2 · Feb 21, 2017 · US
Power semiconductor package having vertically stacked driver IC
US-9502395-B2 · Nov 22, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 19 |
| Infineon Technologies Americas Corp | 14 |
| Int Rectifier Corp | 10 |
| Infineon Technologies Austria Ag | 2 |
| Cypress Semiconductor Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 26 |
| H10W90/736 | 25 |
| H10W70/481 | 22 |
| H10W90/811 | 19 |
| H10W72/874 | 17 |