Semiconductor package including conductive carrier coupled power switches

Patent metadata

Field	Value
Publication number	US-9576887-B2
Application number	US-201314021661-A
Country	US
Kind code	B2
Filing date	Sep 9, 2013
Priority date	Oct 18, 2012
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

In one implementation, a semiconductor package including conductive carrier coupled power switches includes a first vertical FET in a first active die having a first source and a first gate on a source side of the first active die and a first drain on a drain side of the first active die. The semiconductor package also includes a second vertical FET in a second active die having a second source and a second gate on a source side of the second active die and a second drain on a drain side of the second active die. The semiconductor package includes a conductive carrier attached to the source side of the first active die and to the drain side of the second active die, the conductive carrier coupling the first source to the second drain.

First claim

The invention claimed is:

1. A semiconductor package comprising:
a first vertical FET in a first active die having a first source and a first gate on a source side of said first active die and a first drain on a drain side of said first active die;
a second vertical FET in a second active die having a second source and a second gate on a source side of said second active die and a second drain on a drain side of said second active die;
a first conductive carrier attached to said source side of said first active die and to said drain side of said second active die; wherein said first conductive carrier:
includes a side surface of said first conductive carrier is exposed;
electrically couples said first source to said second drain, and
carries the first vertical FET and the second vertical FET by providing structural support element of said semiconductor package;

a second conductive carrier attached to said first gate on said source side of said first active die.

2. The semiconductor package of claim 1 , wherein said first conductive carrier comprises a lead frame.

3. The semiconductor package of claim 1 , wherein said first conductive carrier is a pre-patterned conductive carrier.

4. The semiconductor package of claim 1 , wherein said first and second vertical FETs comprise silicon FETs.

5. The semiconductor package of claim 1 , wherein said first and second vertical FETs comprise III-Nitride FETs.

6. The semiconductor package of claim 1 , wherein said first and second vertical FETs are utilized to implement a switching stage of a buck converter.

7. A semiconductor package comprising:
a power converter switching stage including a control switch in a control active die and a sync switch in a sync active die, each of said control and sync active dies having a first die side and a second die side;
a first conductive carrier attached to said control active die at said first die side of said control active die, and to said sync active die at said second die side of said sync active die;
wherein said first conductive carrier:
includes a side surface that is exposed;
provides a switch node of said power converter switching stage; and
carries said control active die and said sync active die by providing a structural support element of said semiconductor package;

a second conductive carrier attached to said control active die at said first die side of said control active die.

8. The semiconductor package of claim 7 , wherein said first conductive carrier comprises a lead frame.

9. The semiconductor package of claim 7 , wherein said first conductive carrier is a pre-patterned conductive carrier.

10. The semiconductor package of claim 7 , wherein said control switch and said sync switch comprise silicon transistors.

11. The semiconductor package of claim 7 , wherein said control switch and said sync switch comprise III-Nitride transistors.

12. The semiconductor package of claim 7 , wherein said power converter switching stage is implemented as part of a buck converter.

13. A method for fabricating a semiconductor package, said method comprising:
providing a first vertical FET in a first active die having a first source and a first gate on a source side of said first active die and a first drain on a drain side of said first active die;
providing a second vertical FET in a second active die having a second source and a second gate on a source side of said second active die and a second drain on a drain side of said second active die;
attaching a first conductive carrier to said source side of said first active die and to said drain side of said second active die, wherein a side surface of said first conductive carrier is exposed;
utilizing said first conductive carrier to:
couple said first source to said second drain, and
carry the first vertical FET and the second vertical FET by providing a structural support element of said semiconductor package;

attaching a second conductive carrier to said first gate on said source side of said first active die.

14. The method of claim 13 , wherein said first conductive carrier comprises a lead frame.

15. The method of claim 13 , wherein said first conductive carrier is a pre-patterned conductive carrier.

16. The method of claim 13 , wherein said first and second vertical FETs comprise silicon FETs.

17. The method of claim 13 , wherein said first and second vertical FETs comprise III-Nitride FETs.

18. The method of claim 13 , wherein said first and second vertical FETs are utilized to implement a switching stage of a buck converter.

19. The semiconductor package of claim 1 , wherein said first conductive carrier and said second conductive carrier are pre-patterned conductive carriers.

20. The semiconductor package of claim 7 , further comprising a driver integrated circuit (IC) for driving at least one of said control switch and said sync switch.

Assignees

• Infineon Technologies Americas Corp

Inventors

• Cho Eung San
• Sawle Andrew N
• Pavier Mark
• Cutler Daniel

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/874

  On different surfaces · CPC title