Semiconductor package including a semiconductor die having redistributed pads

Patent metadata

Field	Value
Publication number	US-9633951-B2
Application number	US-59520606-A
Country	US
Kind code	B2
Filing date	Nov 10, 2006
Priority date	Nov 10, 2005
Publication date	Apr 25, 2017
Grant date	Apr 25, 2017

Abstract

A semiconductor package that includes a semiconductor die, an insulation around the die, and a conforming conductive pad coupled to an electrode of the die.

First claim

What is claimed is:

1. A semiconductor package, comprising:
a semiconductor die including a power device, said semiconductor die having a plurality of electrodes disposed on one major surface thereof, each of said plurality of electrodes having a respective first area;
an insulation body disposed around said semiconductor die; and
at least three of conforming conductive pads each providing an external connection for a respective one of said plurality of electrodes;
said at least three of conforming conductive pads extending at least partially over said semiconductor die, and extending over and conforming to respective portions of said insulation body;
each of said at least three of conforming conductive pads directly and physically coupled to the respective one of said plurality of electrodes, and having an area that is larger than said respective first area of said respective one of said plurality of electrodes to which it is coupled.

2. The package of claim 1 , wherein each of said at least three of conforming conductive pads includes a solderable surface.

3. The package of claim 1 , further comprising a passivation body disposed over said semiconductor die, said passivation body including an opening over each of said at least three of conforming conductive pads.

4. The package of claim 3 , wherein said passivation body includes solder resist characteristics.

5. The package of claim 1 , further comprising a conductive clip having a web portion coupled to another major surface of said semiconductor die opposite said one major surface.

6. The package of claim 5 , wherein said conductive clip includes at least one lead adjoining said web portion and including a connection surface generally coplanar with a top surface of said at least three of conforming conductive pads.

7. The package of claim 6 , wherein said web portion is coupled to said another major surface by a conductive adhesive body.

8. The package of claim 7 , wherein said conductive adhesive body is comprised of solder or a conductive epoxy.

9. The package of claim 1 , wherein said semiconductor die is a III-nitride semiconductor device.

10. The package of claim 1 , further comprising a conductive clip coupled to another major surface of said semiconductor die opposite said one major surface.

11. The package of claim 10 , wherein said conductive clip is coupled to said another major surface with a conductive adhesive body.

12. The package of claim 11 , wherein said conductive adhesive body is comprised of solder or a conductive epoxy.

13. The package of claim 10 , wherein said conductive clip includes at least one lead and a web portion, wherein said at least one lead extending from an edge of said web portion and including a connection surface generally coplanar with a top surface of said at least three of conforming conductive pads.

14. The package of claim 13 , wherein said web portion of said conductive clip is coupled to said another major surface with a conductive adhesive body.

15. The package of claim 14 , wherein said conductive adhesive body is comprised of solder or a conductive epoxy.

Assignees

• Pavier Mark
• Sawle Andrew N
• Standing Martin
• Infineon Technologies Americas Corp

Inventors

• Pavier Mark
• Sawle Andrew N
• Standing Martin

Classifications

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W72/07354

  changes in dispositions · CPC title

• H10W72/07336

  Soldering or alloying · CPC title

• H10W72/01935

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title