Electrostatic chuck assembly for high temperature processes
US-RE50838-E · Mar 17, 2026 · US
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Parkhe Vijay D patents
Parkhe Vijay D is listed as an inventor on 228 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Parkhe Vijay D |
| Total patents | 228 |
| First publication | Mar 3, 2015 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Electrostatic chuck assembly for high temperature processes
US-RE50821-E · Mar 10, 2026 · US
Substrate-to-substrate bonding using electrostatic chucks
US-2026052945-A1 · Feb 19, 2026 · US
Modular substrate support assembly
US-2025385123-A1 · Dec 18, 2025 · US
Increasing the gas efficiency for an electrostatic chuck
US-12493303-B2 · Dec 9, 2025 · US
Extreme uniformity heated substrate support assembly
US-12488967-B2 · Dec 2, 2025 · US
Semiconductor substrate support with internal channels
US-12476131-B2 · Nov 18, 2025 · US
Substrate support heat transfer structures
US-2025349565-A1 · Nov 13, 2025 · US
Fabrication of substrate support devices using inorganic dielectric bonding
US-2025349590-A1 · Nov 13, 2025 · US
Cryogenic micro-zone electrostatic chuck connector assembly
US-2025305750-A1 · Oct 2, 2025 · US
Recent patents
Latest publications not already listed above.
Modular substrate support assembly
US-12424481-B2 · Sep 23, 2025 · US
Low Cost Electrostatic Chuck for Chucking Insulator Substrates
US-2025293070-A1 · Sep 18, 2025 · US
Substrate warpage compensation
US-2025279310-A1 · Sep 4, 2025 · US
Electrostatic chuck for non-planar substrates
US-2025273499-A1 · Aug 28, 2025 · US
Fabrication of substrate support devices using inorganic dielectric bonding
US-12400896-B2 · Aug 26, 2025 · US
Electrostatic chuck assembly for cryogenic applications
US-12347659-B2 · Jul 1, 2025 · US
Cooled substrate support assembly for radio frequency environments
US-12334315-B2 · Jun 17, 2025 · US
Tunable temperature controlled substrate support assembly
US-12334385-B2 · Jun 17, 2025 · US
Cryogenic micro-zone electrostatic chuck connector assembly
US-12331984-B2 · Jun 17, 2025 · US
Processing chamber with a rotatable pedestal hub
US-2025157796-A1 · May 15, 2025 · US
Low temperature electrostatic chuck
US-2025125181-A1 · Apr 17, 2025 · US
Ground electrode formed in an electrostatic chuck for a plasma processing chamber
US-2025112076-A1 · Apr 3, 2025 · US
Modular substrate support assembly
US-2025105051-A1 · Mar 27, 2025 · US
Substrate support assembly with improved thermal uniformity
US-2025087468-A1 · Mar 13, 2025 · US
Temperature controlled substrate support assembly
US-12243756-B2 · Mar 4, 2025 · US
Susceptor height adjustment
US-2025069928-A1 · Feb 27, 2025 · US
Electrostatic chuck with mesas
US-12224198-B2 · Feb 11, 2025 · US
Ground electrode formed in an electrostatic chuck for a plasma processing chamber
US-12205843-B2 · Jan 21, 2025 · US
Heater plates with distributed purge channels, rf meshes and ground electrodes
US-2025022694-A1 · Jan 16, 2025 · US
High temperature biasable heater with advanced far edge electrode, electrostatic chuck, and embedded ground electrode
US-2024412957-A1 · Dec 12, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 226 |
| Parkhe Vijay D | 4 |
| Boyd Jr Wendell | 3 |
| Busche Matthew J | 2 |
| Thach Senh | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/722 | 164 |
| H01L21/6833 | 151 |
| H10P72/72 | 138 |
| H10P72/0432 | 125 |
| H10P72/0434 | 101 |