Electrostatic chuck with mesas

US12224198B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12224198-B2
Application numberUS-202418584937-A
CountryUS
Kind codeB2
Filing dateFeb 22, 2024
Priority dateApr 15, 2021
Publication dateFeb 11, 2025
Grant dateFeb 11, 2025

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Abstract

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Electrostatic chucks (ESCs) for plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a substrate support assembly includes a ceramic top plate having a top surface with a processing region. One or more electrodes is within the ceramic top plate. A plurality of mesas is within the processing region and on the top surface of the ceramic plate or vertically over an edge of one of the one or more electrodes.

First claim

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What is claimed is: 1. A substrate support assembly, comprising: a ceramic top plate having a top surface with a processing region; one or more electrodes within the ceramic top plate; and a plurality of mesas within the processing region and on the top surface of the ceramic top plate, wherein all of the plurality of mesas are fully over a corresponding one of the one or more electrodes. 2. The substrate support assembly of claim 1 , wherein the plurality of mesas is continuous with the top surface of the ceramic top plate. 3. The substrate support assembly of claim 1 , wherein the ceramic top plate comprises aluminum nitride. 4. The substrate support assembly of claim 1 , wherein the ceramic top plate comprises aluminum oxide. 5. The substrate support assembly of claim 1 , wherein the one or more electrodes comprise molybdenum. 6. A substrate support assembly, comprising: a ceramic top plate having a top surface with a processing region; a molybdenum mesh within the ceramic top plate; and a plurality of mesas within the processing region and on the top surface of the ceramic top plate, wherein all of the plurality of mesas are fully over the molybdenum mesh. 7. The substrate support assembly of claim 6 , wherein the ceramic top plate comprises aluminum nitride. 8. The substrate support assembly of claim 6 , wherein the ceramic top plate comprises aluminum oxide. 9. A substrate support assembly, comprising: a ceramic top plate having a top surface with a processing region, the top surface having one or more high topography regions and one or more electrodes within the ceramic top plate; and a plurality of mesas within the processing region and on the top surface of the ceramic top plate, wherein all of the plurality of mesas are fully over a corresponding one of the one or more electrodes. 10. The substrate support assembly of claim 9 , wherein the plurality of mesas is continuous with the top surface of the ceramic top plate. 11. The substrate support assembly of claim 9 , wherein the ceramic top plate comprises aluminum nitride. 12. The substrate support assembly of claim 9 , wherein the ceramic top plate comprises aluminum oxide. 13. The substrate support assembly of claim 9 , further comprising one or more electrodes comprising molybdenum. 14. A substrate support assembly, comprising: a ceramic top plate having a top surface with a processing region, the top surface having one or more stress regions; one or more electrodes within the ceramic top plate; and a plurality of mesas within the processing region and on the top surface of the ceramic top plate, wherein all of the plurality of mesas are fully over a corresponding one of the one or more electrodes. 15. The substrate support assembly of claim 14 , wherein the plurality of mesas is continuous with the top surface of the ceramic top plate. 16. The substrate support assembly of claim 14 , wherein the ceramic top plate comprises aluminum nitride. 17. The substrate support assembly of claim 14 , wherein the ceramic top plate comprises aluminum oxide. 18. The substrate support assembly of claim 14 , further comprising one or more electrodes comprising molybdenum.

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What does patent US12224198B2 cover?
Electrostatic chucks (ESCs) for plasma processing chambers, and methods of fabricating ESCs, are described. In an example, a substrate support assembly includes a ceramic top plate having a top surface with a processing region. One or more electrodes is within the ceramic top plate. A plurality of mesas is within the processing region and on the top surface of the ceramic plate or vertically ov…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/722. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 11 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).