Substrate support heat transfer structures

Patent metadata

Field	Value
Publication number	US-2025349565-A1
Application number	US-202519195829-A
Country	US
Kind code	A1
Filing date	May 1, 2025
Priority date	May 13, 2024
Publication date	Nov 13, 2025
Grant date	—

Abstract

Embodiments of the disclosure include apparatus and methods for transferring heat between a substrate and a substrate support. The substrate support is disposed within a processing chamber. A heat exchanging element is disposed within the substrate support. A plurality of heat transfer structures extend from a surface of a substrate base of the substrate support. The heat transfer structures are configured to transfer heat between the substrate and the substrate support.

First claim

We claim:

1 . An apparatus comprising:
a processing chamber; a substrate support disposed within the processing chamber; a heating element disposed within the substrate support; and a plurality of heat transfer structures extending from a surface of the substrate support, the heat transfer structures configured to transfer heat to a substrate.

2 . The apparatus of claim 1 , wherein one or more of the heat transfer structures are configured to transfer the heat to the substrate from the heating element.

3 . The apparatus of claim 1 , wherein one or more of the heat transfer structures are configured to elastically deform in response to a contact with the substrate.

4 . The apparatus of claim 1 , wherein the one or more of the heat transfer structures are configured to increase a contact area with the substrate.

5 . The apparatus of claim 1 , wherein one or more of the heat transfer structures include electrodes coupled to a DC voltage source.

6 . The apparatus of claim 5 , wherein a DC voltage source is configured to apply a bias to a pair of electrodes that generates an electrostatic force configured to chuck the substrate.

7 . The apparatus of claim 1 , wherein one or more of the heat transfer structures includes at least one of aluminum nitride, aluminum, silver, copper, gold, zinc, graphite, graphene, silicon carbide, tungsten, or diamond-like carbon.

8 . The apparatus of claim 1 , wherein one or more of the heat transfer structures have a shape memory.

9 . The apparatus of claim 1 , wherein the substrate is bowed, a first group of the heat transfer structures extend a first distance from the surface of the substrate support, and a second group of the heat transfer structures extend a second distance from the surface of the substrate support.

10 . The apparatus of claim 1 , further comprising a vacuum source configured to generate a vacuum pressure to chuck the substrate against the heat transfer structures.

11 . The apparatus of claim 1 , wherein one or more of the heat transfer structures includes carbon nanotubes.

12 . The apparatus of claim 1 , wherein one or more of the heat transfer structures have a thermal conductivity in a range of 100 to 2000 watts per meter-kelvin.

13 . The apparatus of claim 1 , wherein the heat transfer structures comprise a plurality of pins that comprise a length to diameter ratio greater than 5, such as 50.

14 . A method comprising:
disposing a substrate over a plurality of heat transfer structures extending from a surface of a substrate support; deforming at least some of the heat transfer structures; and transferring heat between a heat exchanging element of the substrate support and the substrate by use of one or more of the heat transfer structures.

15 . The method of claim 14 , wherein the one or more of the heat transfer structures are configured to transfer the heat to the substrate by thermal conduction.

16 . The method of claim 14 , wherein the one or more of the heat transfer structures have a thermal conductivity in a range of 100 to 2000 watts per meter-kelvin.

17 . The method of claim 14 , wherein the one or more of the heat transfer structures have a shape memory.

18 . The method of claim 14 , further comprising chucking the substrate by generating a vacuum pressure to vacuum chuck the substrate against the heat transfer structures.

19 . The method of claim 14 , further comprising chucking the substrate by generating an electrostatic force between the heat transfer structures and a surface of a substrate.

20 . The method of claim 14 , wherein the heat transfer structures comprise a plurality of pins that comprise a length to diameter ratio greater than 5, such as 50.

Assignees

• Applied Materials Inc

Inventors

• Parkhe Vijay D

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/78 Primary

  using vacuum or suction, e.g. Bernoulli chucks · CPC title

• H10P72/0432 Primary

  mainly by conduction · CPC title

• H10P72/7616

  characterised by a coating, a hardness or a material · CPC title

• H10P72/0434

  mainly by convection · CPC title