Power semiconductor device
US-12308305-B2 · May 20, 2025 · US
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Oya Daisuke patents
Oya Daisuke is listed as an inventor on 29 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Oya Daisuke |
| Total patents | 29 |
| First publication | Apr 21, 2016 |
| Latest publication | May 20, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Aluminum/ceramic bonding substrate and method for producing same
US-12221389-B2 · Feb 11, 2025 · US
Power semiconductor device
US-2024297104-A1 · Sep 5, 2024 · US
Integrally bonded semiconductor device and power converter including the same
US-11887904-B2 · Jan 30, 2024 · US
Semiconductor device including a groove within a resin insulating part positioned between and covering parts of a first electrode and a second electrode
US-11569141-B2 · Jan 31, 2023 · US
Semiconductor device and manufacturing method of semiconductor device
US-2022359423-A1 · Nov 10, 2022 · US
Semiconductor-mounting heat dissipation base plate and production method therefor
US-11484936-B2 · Nov 1, 2022 · US
Semiconductor device and power converter
US-2022165631-A1 · May 26, 2022 · US
Semiconductor module and power conversion apparatus
US-11271043-B2 · Mar 8, 2022 · US
Aluminum/ceramic bonding substrate and method for producing same
US-2022033317-A1 · Feb 3, 2022 · US
Recent patents
Latest publications not already listed above.
Semiconductor device
US-2021217675-A1 · Jul 15, 2021 · US
Semiconductor-mounting heat dissipation base plate and production method therefor
US-2021121943-A1 · Apr 29, 2021 · US
Semiconductor-mounting heat dissipation base plate and production method therefor
US-10898946-B2 · Jan 26, 2021 · US
Semiconductor module and power conversion apparatus
US-2020266240-A1 · Aug 20, 2020 · US
Semiconductor device
US-10748830-B2 · Aug 18, 2020 · US
Semiconductor device manufacturing method including forming a wide portion spreading over a looped portion
US-10651121-B2 · May 12, 2020 · US
Semiconductor module
US-10483176-B2 · Nov 19, 2019 · US
Metal-ceramic bonded substrate, and manufacturing method thereof
US-2019350078-A1 · Nov 14, 2019 · US
Semiconductor device and semiconductor device manufacturing method
US-2019244889-A1 · Aug 8, 2019 · US
Semiconductor device
US-2019206757-A1 · Jul 4, 2019 · US
Semiconductor device including a cylindrical electrode inserted into a looped portion of an electrode
US-10340217-B2 · Jul 2, 2019 · US
Semiconductor-mounting heat dissipation base plate and production method therefor
US-2019111467-A1 · Apr 18, 2019 · US
Semiconductor module
US-2018286771-A1 · Oct 4, 2018 · US
Power semiconductor device
US-D827590-S · Sep 4, 2018 · US
Semiconductor device and semiconductor device manufacturing method
US-2018247888-A1 · Aug 30, 2018 · US
Power semiconductor device
US-D798832-S · Oct 3, 2017 · US
Power semiconductor device
US-D790491-S · Jun 27, 2017 · US
Semiconductor device
US-9445497-B2 · Sep 13, 2016 · US
Semiconductor device
US-2016113112-A1 · Apr 21, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Electric Corp | 29 |
| Dowa Metaltech Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/754 | 13 |
| H10W40/255 | 13 |
| H10W76/15 | 12 |
| H10W90/00 | 10 |
| H10W40/10 | 9 |