Semiconductor device including a cylindrical electrode inserted into a looped portion of an electrode

Patent metadata

Field	Value
Publication number	US-10340217-B2
Application number	US-201715797027-A
Country	US
Kind code	B2
Filing date	Oct 30, 2017
Priority date	Feb 24, 2017
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

A semiconductor device includes a semiconductor chip, an electrode electrically connected to the semiconductor chip, the electrode including a looped portion, a cylindrical electrode including a main portion having a screw thread formed therein and a narrow portion continuous with the main portion, the narrow portion having a smaller width than the main portion, the cylindrical electrode being electrically connected to the electrode by the narrow portion being inserted into the looped portion, and a case for the semiconductor chip and the electrode, the case contacting the main portion while causing the screw thread and a connecting portion between the looped portion and the cylindrical electrode to be exposed.

First claim

What is claimed is:

1. A semiconductor device comprising:
a semiconductor chip;
an electrode electrically connected to the semiconductor chip, the electrode including a looped portion;
a cylindrical electrode including a main portion having a screw thread formed therein and a narrow portion continuous with the main portion, the narrow portion having a smaller width than the main portion, the cylindrical electrode being electrically connected to the electrode by the narrow portion being inserted into the looped portion; and
a case for the semiconductor chip and the electrode, the case contacting the main portion and a top surface of the looped portion, while causing the screw thread and a connecting portion between the looped portion and the cylindrical electrode to be exposed.

2. The semiconductor device according to claim 1 , wherein an inside wall of the looped portion contacts the narrow portion.

3. The semiconductor device according to claim 1 , wherein
the cylindrical electrode includes a wide portion which is connected to the narrow portion and has a larger width than the narrow portion, and
the top surface of the looped portion contacts the main portion, and a bottom surface of the looped portion contacts the wide portion.

4. The semiconductor device according to claim 3 , wherein an outside diameter of the looped portion is larger than an outside diameter of the wide portion.

5. The semiconductor device according to claim 1 , wherein the looped portion is circular in planar view.

6. The semiconductor device according to claim 1 , wherein an outside diameter of the looped portion is equal to or more than a width of the main portion.

7. The semiconductor device according to claim 1 , wherein
the cylindrical electrode has a rib on a side surface of the main portion, and
the case covers the rib.

8. The semiconductor device according to claim 1 , wherein a screw thread is formed on a side wall of the narrow portion, a screw thread is formed on an inside wall of the looped portion, and the narrow portion and the looped portion are screwed together.

9. The semiconductor device according to claim 1 , wherein the narrow portion and the looped portion are in contact with each other by snap fit.

10. The semiconductor device according to claim 1 , wherein the semiconductor chip is made of a wide bandgap semiconductor.

11. The semiconductor device according to claim 10 , wherein the wide bandgap semiconductor is any one of silicon carbide, a gallium nitride material, and diamond.

Assignees

• Mitsubishi Electric Corp

Inventors

• Oya Daisuke
• Yokota Satoshi

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W70/479

  on or in insulating or insulated package substrates, interposers, or redistribution layers · CPC title

• H10W40/00

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• H10W76/15 Primary

  Containers comprising an insulating or insulated base · CPC title

• H10W72/60

  Strap connectors, e.g. thick copper clips for grounding of power devices · CPC title