Semiconductor module and power conversion apparatus

Patent metadata

Field	Value
Publication number	US-11271043-B2
Application number	US-201816488752-A
Country	US
Kind code	B2
Filing date	Apr 11, 2018
Priority date	Apr 19, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

An emitter interconnection connecting the emitter of a semiconductor switching element to a negative electrode is different in one or both of length and width from an emitter interconnection connecting the emitter of a semiconductor switching element to the negative electrode. At the time of switching, an induced electromotive force is generated at a gate control wire, or at a gate pattern, or at an emitter wire, by at least one of a current flowing through a positive electrode and a current flowing through the negative electrode, so as to reduce the difference between the emitter potential of the semiconductor switching element and the emitter potential of the semiconductor switching element caused by the difference.

First claim

The invention claimed is:

1. A semiconductor module comprising: an insulating plate; a positive electrode; a negative electrode; a first semiconductor switching element and a second semiconductor switching element provided on the insulating plate and connected in parallel between the positive electrode and the negative electrode; a gate control electrode configured to control a gate of the first semiconductor switching element and a gate of the second semiconductor switching element; a gate pattern connected to the gate control electrode; a first gate control wire connecting the gate of the first semiconductor switching element to the gate pattern; a second gate control wire connecting the gate of the second semiconductor switching element to the gate pattern; an emitter pattern connected to the negative electrode; a first emitter wire connecting an emitter of the first semiconductor switching element to the emitter pattern; and a second emitter wire connecting an emitter of the second semiconductor switching element to the emitter pattern, a first emitter interconnection connecting the emitter of the first semiconductor switching element to the negative electrode being different in one or both of length and width from a second emitter interconnection connecting the emitter of the second semiconductor switching element to the negative electrode, at a time of switching, an induced electromotive force being generated at the first gate control wire and the second gate control wire, or at the gate pattern, or at the first emitter wire and the second emitter wire, by at least one of a current flowing through the positive electrode and a current flowing through the negative electrode, so as to reduce a difference between an emitter potential of the first semiconductor switching element and an emitter potential of the second semiconductor switching element caused by the difference of the emitter interconnections.

2. The semiconductor module according to claim 1 , wherein at least one of the positive electrode and the negative electrode has a current path of principal current not perpendicular to the first gate control wire and not perpendicular to the second gate control wire.

3. The semiconductor module according to claim 2 , wherein at least one of the positive electrode and the negative electrode has a current path of principal current parallel to the first gate control wire and parallel to the second gate control wire.

4. The semiconductor module according to claim 3 , wherein
at the time of the switching, the emitter potential of the first semiconductor switching element is higher than the emitter potential of the second semiconductor switching element,
where a proximal electrode part is defined as one of two parts whichever is located closer to the insulating plate, one of the two parts being a part of the positive electrode that is parallel to the insulating plate, the other of the two parts being a part of the negative electrode that is parallel to the insulating plate,
the first gate control wire and the second gate control wire are parallel to the current path of principal current in the proximal electrode part,
a direction of current through the current path of principal current in the proximal electrode part is opposite to a direction of current flowing through the first gate control wire and the second gate control wire, and
the first gate control wire is located closer to the current path of principal current in the proximal electrode part than the second gate control wire is located.

5. The semiconductor module according to claim 3 , wherein
at the time of the switching, the emitter potential of the first semiconductor switching element is higher than the emitter potential of the second semiconductor switching element,
where a proximal electrode part is defined as one of two parts whichever is located closer to the insulating plate, one of the two parts being a part of the positive electrode that is parallel to the insulating plate, the other of the two parts being a part of the negative electrode that is parallel to the insulating plate,
the first gate control wire and the second gate control wire are parallel to the current path of principal current in the proximal electrode part,
a direction of current through the current path of principal current in the proximal electrode part is the same as a direction of current flowing through the first gate control wire and the second gate control wire, and
the first gate control wire is located more remote from the current path of principal current in the proximal electrode part than the second gate control wire is located.

6. The semiconductor module according to claim 5 , further comprising:
an emitter control electrode configured to control the emitter of the first semiconductor switching element and the emitter of the second semiconductor switching element;
an emitter control pattern connected to the emitter control electrode;
a first emitter control wire connecting the emitter of the first semiconductor switching element to the emitter control pattern; and
a second emitter control wire connecting the emitter of the second semiconductor switching element to the emitter control pattern, wherein
an induced electromotive force is generated at the first emitter control wire and the second emitter control wire, by at least one of a current flowing through the positive electrode and a current flowing through the negative electrode,
at the time of the switching, when a difference between the emitter potential of the first semiconductor switching element and the emitter potential of the second semiconductor switching element is equal to a difference between the induced electromotive force generated at the second gate control wire and the induced electromotive force generated at the first gate control wire, a distance between the current path of principal current in the proximal electrode part and the first emitter control wire is equal to a distance between the current path of principal current in the proximal electrode part and the second emitter control wire,
at the time of the switching, when the difference between the emitter potential of the first semiconductor switching element and the emitter potential of the second semiconductor switching element is larger than the difference between the induced electromotive force generated at the second gate control wire and the induced electromotive force generated at the first gate control wire, the distance between the current path of principal current in the proximal electrode part and the first emitter control wire is shorter than the distance between the current path of principal current in the proximal electrode part and the second emitter control wire, and
at the time of the switching, when the difference between the emitter potential of the first semiconductor switching element and the emitter potential of the second semiconductor switching element is smaller than the difference between the induced electromotive force generated at the second gate control wire and the induced electromotive force generated at the first gate control wire, the distance between the current path of principal current in the proximal electrode part and the first emitter control wire is longer than the distance between the current path of principal current in the proximal electrode part and the second emitter control wire.

7. The semiconductor module according to claim 3 , wherein the first gate control wire is shorter than the second gate control wire.

8. The semiconductor module according to claim 1 , wherein at least one of the positive electrode and the negative electrode has a current path of principal current that is perpendicular to the first gate control wire, perpendic

Assignees

• Mitsubishi Electric Corp

Inventors

• Morisaki Shota
• TAMADA Yoshiko
• Nakashima Junichi
• Oya Daisuke

Classifications

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W72/5438

  the bond wires having multiple connections on the same bond pad · CPC title

• H10W90/753

  between laterally-adjacent chips · CPC title