Method for producing ceramic/metal bonded object
US-2026085427-A1 · Mar 26, 2026 · US
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Osanai Hideyo patents
Osanai Hideyo is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Osanai Hideyo |
| Total patents | 23 |
| First publication | Jan 6, 2015 |
| Latest publication | Mar 26, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Metal/ceramic bonding substrate and method for producing same
US-12300512-B2 · May 13, 2025 · US
Aluminum/ceramic bonding substrate and method for producing same
US-12221389-B2 · Feb 11, 2025 · US
Metal/ceramic bonding substrate and method for producing same
US-12145352-B2 · Nov 19, 2024 · US
Method for producing heat radiation member
US-11919288-B2 · Mar 5, 2024 · US
Metal/ceramic bonding substrate and method for producing same
US-2022367316-A1 · Nov 17, 2022 · US
Heat radiation member and method for producing same
US-2022080704-A1 · Mar 17, 2022 · US
Metal/ceramic bonding substrate and method for producing same
US-2022032580-A1 · Feb 3, 2022 · US
Aluminum/ceramic bonding substrate and method for producing same
US-2022033317-A1 · Feb 3, 2022 · US
Heat radiating plate and method for producing same
US-11162745-B2 · Nov 2, 2021 · US
Recent patents
Latest publications not already listed above.
Heat radiating plate with supporting members and protrusion members
US-10619948-B2 · Apr 14, 2020 · US
Electronic part mounting substrate and method for producing same
US-2020083062-A1 · Mar 12, 2020 · US
Heat radiating plate and method for producing same
US-2020064087-A1 · Feb 27, 2020 · US
Electronic part mounting substrate and method for producing same
US-10510557-B2 · Dec 17, 2019 · US
Metal/ceramic bonding substrate and method for producing same
US-9944565-B2 · Apr 17, 2018 · US
Method of attaching an electronic part to a copper plate having a surface roughness
US-9831157-B2 · Nov 28, 2017 · US
Metal/ceramic bonding substrate and method for producing same
US-9713253-B2 · Jul 18, 2017 · US
Manufacturing method of radiator-integrated substrate and radiator-integrated substrate
US-9474146-B2 · Oct 18, 2016 · US
Electronic part mounting substrate and method for producing same
US-2016211195-A1 · Jul 21, 2016 · US
Liquid-cooled integrated substrate and manufacturing method of liquid-cooled integrated substrate
US-9320129-B2 · Apr 19, 2016 · US
Metal/ceramic bonding substrate and method for producing same
US-2015284296-A1 · Oct 8, 2015 · US
Manufacturing method of radiator-integrated substrate and radiator-integrated substrate
US-2015041187-A1 · Feb 12, 2015 · US
Fin-integrated substrate and manufacturing method of fin-integrated substrate
US-8927873-B2 · Jan 6, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Dowa Metaltech Co Ltd | 24 |
| Nippon Light Metal Co | 4 |
| Osanai Hideyo | 3 |
| Takahashi Takayuki | 3 |
| Tokuyama Corp | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/255 | 20 |
| H01L23/3735 | 13 |
| H10W70/02 | 11 |
| C04B2237/366 | 8 |
| H05K1/0306 | 8 |