Electrostatic chuck
US-2024297063-A1 · Sep 5, 2024 · US
Aluminium nitride
Aluminium nitride · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C04B2237/366 |
| Official title | Aluminium nitride |
| Display label | Aluminium nitride |
| Total patents | 570 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 45 |
| 2016 | 49 |
| 2017 | 44 |
| 2018 | 38 |
| 2019 | 46 |
| 2020 | 56 |
| 2021 | 53 |
| 2022 | 56 |
| 2023 | 64 |
| 2024 | 58 |
| 2025 | 52 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Joined body manufacturing method
US-2016368829-A1 · Dec 22, 2016 · US
Bonding material composition, aluminum nitride bonded body, and method for producing the same
US-2016361900-A1 · Dec 15, 2016 · US
Bonding material composition, aluminum nitride bonded body, and method for producing the same
US-9481813-B2 · Nov 1, 2016 · US
Power module substrate, power module substrate with heat sink, and power module
US-9480144-B2 · Oct 25, 2016 · US
Bonded body and power module substrate
US-2016249452-A1 · Aug 25, 2016 · US
Power module substrate, power module substrate with metal part, power module with metal part, method for producing power module substrate, and method for producing power module substrate with metal part
US-2016219693-A1 · Jul 28, 2016 · US
Semiconductor device and ceramic circuit substrate, and producing method of semiconductor device
US-9401340-B2 · Jul 26, 2016 · US
Method for producing electrostatic chuck and electrostatic chuck
US-9394206-B2 · Jul 19, 2016 · US
Process and Formulation to Join Ceramic Forms While Maintaining Structural and Physical Characteristics Across The Bond Surface
US-2016185935-A1 · Jun 30, 2016 · US
Method of producing bonded body and method of producing power module substrate
US-2016181123-A1 · Jun 23, 2016 · US
Laminated roofing product including recycled roofing material and method of forming the same
US-9290944-B2 · Mar 22, 2016 · US
Process for producing a high-temperature-resistant composite body
US-9269525-B2 · Feb 23, 2016 · US
Sample holder
US-2016005639-A1 · Jan 7, 2016 · US
High speed differential wiring in glass ceramic MCMS
US-9232645-B2 · Jan 5, 2016 · US
CMC blade with integral 3D woven platform
US-9212560-B2 · Dec 15, 2015 · US
Method of manufacturing honeycomb structured body
US-9199188-B2 · Dec 1, 2015 · US
Electrostatic chuck
US-9202718-B2 · Dec 1, 2015 · US
Bonded body and semiconductor module
US-9196563-B2 · Nov 24, 2015 · US
Advanced layered bulk ceramics via field assisted sintering technology
US-2015329430-A1 · Nov 19, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C04B2237/366?
- CPC C04B2237/366 is the Cooperative Patent Classification code for “Aluminium nitride.”
- How many patents are filed under CPC C04B2237/366 (Aluminium nitride)?
- Our database includes 570 publications tagged with this CPC code.
- Is patent activity under CPC C04B2237/366 growing?
- Publication counts under this code: 58 in 2024 vs 52 in 2025 (latest complete years).