Metal/ceramic bonding substrate and method for producing same

Patent metadata

Field	Value
Publication number	US-9713253-B2
Application number	US-201114006546-A
Country	US
Kind code	B2
Filing date	Mar 29, 2011
Priority date	Mar 23, 2011
Publication date	Jul 18, 2017
Grant date	Jul 18, 2017

Abstract

A metal/ceramic bonding substrate includes: a ceramic substrate; a metal plate bonded directly to one side of the ceramic substrate; a metal base plate bonded directly to the other side of the ceramic substrate; and a reinforcing member having a higher strength than that of the metal base plate, the reinforcing member being arranged so as to extend from one of both end faces of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof.

First claim

The invention claimed is:

1. A metal/ceramic bonding substrate comprising:
a ceramic substrate;
a metal plate bonded directly to one side of the ceramic substrate;
a metal base plate bonded directly to the other side of the ceramic substrate; and
a reinforcing plate member arranged so as to extend from one of both end faces in the directions of one of longitudinal and lateral directions of the metal base plate to the other end face thereof without interrupting that the metal base plate extends between a bonded surface of the metal base plate to the ceramic substrate and the opposite surface thereof, the reinforcing plate member extending in parallel to the bonded surface, both end faces in longitudinal directions of the reinforcing plate member being exposed to the outside, the whole surface of the reinforcing plate member except for the both end faces thereof being bonded directly to the metal base plate.

2. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said metal base plate has a portion extending in directions perpendicular to said bonded surface.

3. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said reinforcing plate member has a surface which extends in parallel to said bonded surface and which has a portion facing said ceramic substrate, the portion of the surface of said reinforcing plate member having a smaller area than that of said bonded surface.

4. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said reinforcing plate member comprises a plurality of plate or rod members which are arranged on a plane extending in parallel to said bonded surface and which are spaced from each other at predetermined intervals to extend in parallel to each other.

5. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said reinforcing plate member is a lattice-shaped plate member comprising a plurality of longitudinal plate portions, which are arranged on a plane extending in parallel to said bonded surface and which are spaced from each other at predetermined intervals to extend in longitudinal directions of said metal base plate, and a plurality of lateral plate portions which are spaced from each other at predetermined intervals to extend in lateral directions of said metal base plate to connect the longitudinal plate portions to each other.

6. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said reinforcing plate member is made of a steel or a metal which contains iron and at least one selected from the group consisting of nickel, cobalt, copper and manganese.

7. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said reinforcing plate member is made of at least one ceramic selected from the group consisting of alumina, aluminum nitride, silicon nitride and silicon carbide.

8. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said metal base plate is made of aluminum or an aluminum alloy.

9. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said metal plate is made of aluminum or an aluminum alloy.

10. A metal/ceramic bonding substrate as set forth in claim 1 , wherein said ceramic substrate is made of at least one ceramic selected from the group consisting of alumina, aluminum nitride, silicon nitride and silicon carbide.

Assignees

• Osanai Hideyo
• Takahashi Takayuki
• Ideguchi Satoru
• Kotani Hirotaka
• Dowa Metaltech Co Ltd

Inventors

• Osanai Hideyo
• Takahashi Takayuki
• Ideguchi Satoru
• Kotani Hirotaka

Classifications

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title

• H10W70/02

  of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• Y10T428/2457

  Parallel ribs and/or grooves · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title