Method for producing heat radiation member

US11919288B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11919288-B2
Application numberUS-202117468808-A
CountryUS
Kind codeB2
Filing dateSep 8, 2021
Priority dateSep 15, 2020
Publication dateMar 5, 2024
Grant dateMar 5, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for producing a heat radiation member comprising charging a molten metal of aluminum or an aluminum alloy in a cast mold having a carbon material having a following property (A) disposed therein, so as to fill a space inside the cast mold with the molten metal, and then solidifying the molten metal, so as to form a laminated structure including a metal material containing aluminum or an aluminum alloy and the carbon material bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m 2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m 2 or more. 2. The method for producing a heat radiation member according to claim 1 , wherein the carbon material has a bending strength of 40 MPa or more.

Assignees

Inventors

Classifications

  • by flowing liquids, e.g. forced water cooling · CPC title

  • having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

  • Assembling together parts thereof · CPC title

  • of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title

  • Structural arrangements therefor · CPC title

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What does patent US11919288B2 cover?
To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressuri…
Who is the assignee on this patent?
Dowa Metaltech Co Ltd
What technology area does this patent fall under?
Primary CPC classification H10W40/25. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 05 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).