Semiconductor-mounting heat dissipation base plate and production method therefor
US-10898946-B2 · Jan 26, 2021 · US
US11919288B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11919288-B2 |
| Application number | US-202117468808-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 8, 2021 |
| Priority date | Sep 15, 2020 |
| Publication date | Mar 5, 2024 |
| Grant date | Mar 5, 2024 |
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To provide a heat radiation member having high durability that can favorably retain the thermal conductivity under application of heat cycles, suitable for mounting a semiconductor element of a power module. The heat radiation member includes a laminated structure including metal materials 21 and 22 and a carbon material 10 having the following property (A) bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m2 or more.
Opening claim text (preview).
What is claimed is: 1. A method for producing a heat radiation member comprising charging a molten metal of aluminum or an aluminum alloy in a cast mold having a carbon material having a following property (A) disposed therein, so as to fill a space inside the cast mold with the molten metal, and then solidifying the molten metal, so as to form a laminated structure including a metal material containing aluminum or an aluminum alloy and the carbon material bonded to each other; (A) in pressurizing one principal surface of a plate specimen having a thickness of 11 mm of the carbon material with nitrogen gas of 200 kPa, the carbon material having a gas permeability of the nitrogen gas permeating to the other principal surface with a flow rate of 5 L/min or more and 30 L/min or less per 0.01 m 2 in terms of area of the pressurized principal surface, the pressurized principal surface having an area of 0.005 m 2 or more. 2. The method for producing a heat radiation member according to claim 1 , wherein the carbon material has a bending strength of 40 MPa or more.
by flowing liquids, e.g. forced water cooling · CPC title
having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title
Assembling together parts thereof · CPC title
of conductive package substrates serving as an interconnection, e.g. of metal plates (manufacture or treatment of leadframes H10W70/04) · CPC title
Structural arrangements therefor · CPC title
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