Manufacturing method of radiator-integrated substrate and radiator-integrated substrate

Patent metadata

Field	Value
Publication number	US-9474146-B2
Application number	US-201314386271-A
Country	US
Kind code	B2
Filing date	Mar 13, 2013
Priority date	Mar 19, 2012
Publication date	Oct 18, 2016
Grant date	Oct 18, 2016

Abstract

A metal circuit board and a metal base plate are bonded to a ceramic substrate to form a metal-ceramic bonded substrate, then the metal base plate is arranged on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator, a jig having a concave R surface is arranged on another surface of the radiator with the jig butting against the another surface of the radiator, a jig having a convex R surface protruding toward the metal-ceramic bonded substrate is brought into contact with another surface of the metal circuit board, and the metal-ceramic bonded substrate and the radiator are heat-bonded while they are pressurized by the radiator side jig and the metal-ceramic bonded substrate side jig, wherein a curvature radius R (mm) of the convex R surface and the concave R surface is 6500≦R≦surface pressure (N/mm 2 )×2000+12000.

First claim

What is claimed:

1. A manufacturing method of a radiator-integrated substrate comprising one surface of a metal circuit board made of aluminum or an aluminum alloy that is bonded to one surface of a ceramic substrate, and a metal base plate, wherein one surface of the metal base plate made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate, and another surface of the metal base plate is bonded to a radiator, the method comprising:
bonding the metal circuit board and the metal base plate to the ceramic substrate to form a metal-ceramic bonded substrate;
then arranging the metal base plate of the metal-ceramic bonded substrate on one surface of the radiator via a brazing material with the metal base plate overlapping with the one surface of the radiator;
arranging a jig having a concave R surface on another surface of the radiator with the jig butting against the another surface of the radiator;
bringing a jig having a convex R surface protruding toward the metal-ceramic bonded substrate into contact with another surface of the metal circuit board of the metal-ceramic bonded substrate; and
heat-bonding the metal-ceramic bonded substrate and the radiator while pressurizing the metal-ceramic bonded substrate and the radiator by the jig arranged on the radiator side and the jig arranged on the metal-ceramic bonded substrate side,
wherein a curvature radius R (mm) of the convex R surface and the concave R surface is
6500 ≦R ≦surface pressure(N/mm 2 )×2000+12000.

2. The manufacturing method of a radiator-integrated substrate according to claim 1 ,
wherein the ceramic substrate is rectangular, and a long side thereof is 40 mm or more.

3. The manufacturing method of a radiator-integrated substrate according to claim 1 ,
wherein the surface pressure applied to the metal circuit board is 1.0 N/mm 2 or more.

4. The manufacturing method of a radiator-integrated substrate according to claim 1 ,
wherein the surface pressure applied to the metal circuit board is 5.0 N/mm 2 or less.

5. The manufacturing method of a radiator-integrated substrate according to claim 1 ,
wherein a thickness t1 of the metal circuit board and a thickness t2 of the metal base plate satisfy t2/t1≦2, and t1 is 0.4 to 3 mm and t2 is 0.8 to 6 mm.

6. The manufacturing method of a radiator-integrated substrate according to claim 1 ,
wherein the radiator is an extrusion member made of aluminum or an aluminum alloy.

7. The manufacturing method of a radiator-integrated substrate according to claim 1 ,
wherein bonding of the ceramic substrate and the metal circuit board and bonding of the ceramic substrate and the metal base plate are performed by a molten metal bonding method.

8. A radiator-integrated substrate manufactured by the manufacturing method according to claim 1 .

9. The radiator-integrated substrate according to claim 8 ,
wherein a warpage amount of a front surface of the metal circuit board of the metal-ceramic bonded substrate after the metal-ceramic bonded substrate and the radiator are braze-bonded together is 2 μm/mm or less.

10. A radiator-integrated substrate comprising one surface of a metal circuit board made of aluminum or an aluminum alloy that is bonded to one surface of a ceramic substrate, and a metal base plate, wherein one surface of the metal base plate made of aluminum or an aluminum alloy is bonded to another surface of the ceramic substrate, and another surface of the metal base plate is bonded to a radiator via a brazing material,
wherein the ceramic substrate is rectangular and a long side thereof is 40 mm or more, and a warpage amount of a front surface of the metal circuit board of the metal-ceramic bonded substrate is 2 μm/mm or less.

Assignees

• Nippon Light Metal Co
• Dowa Metaltech Co Ltd
• Dow A Metaltech Co Ltd

Inventors

• Hori Hisashi
• Kokubo Takanori
• Osanai Hideyo
• Chihara Kunihiko

Classifications

• H10W40/47

  by flowing liquids, e.g. forced water cooling · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/037

  Assembling together parts thereof · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title

• B23K1/19

  taking account of the properties of the materials to be soldered · CPC title