Metal/ceramic bonding substrate and method for producing same

Patent metadata

Field	Value
Publication number	US-12145352-B2
Application number	US-202017430894-A
Country	US
Kind code	B2
Filing date	Feb 10, 2020
Priority date	Feb 22, 2019
Publication date	Nov 19, 2024
Grant date	Nov 19, 2024

Abstract

A metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing same, wherein the method includes arranging a ceramic substrate in a mold; putting the mold in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold to contact the surface of the ceramic substrate; and cooling and solidifying the molten metal to form a metal plate for a circuit pattern of aluminum on one side of the ceramic substrate to bond one side of the metal plate for a circuit pattern directly to the ceramic substrate, while forming a metal base plate of aluminum on the other side of the ceramic substrate.

First claim

The invention claimed is:

1. A method for producing a metal/ceramic bonding substrate, the method comprising the steps of:
arranging a ceramic substrate in a mold;
putting the mold in a furnace, inner walls of which are coated with an air permeable heat insulating material;
supplying an inert gas or a reducing gas to the heat insulating material of upper and lower inner walls of the furnace to introduce the gas via the heat insulating material of the upper and lower inner walls to lower an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace;
injecting a molten metal of aluminum into the mold so as to allow the molten metal to contact one side of the ceramic substrate; and
cooling and solidifying the molten metal in the mold to form an aluminum plate on the one side of the ceramic substrate to bond the aluminum plate directly to the ceramic substrate.

2. A method for producing a metal/ceramic bonding substrate as set forth in claim 1 , wherein the aluminum plate is an aluminum plate for a circuit pattern.

3. A method for producing a metal/ceramic bonding substrate as set forth in claim 1 , wherein when the molten metal of aluminum is injected into the mold so as to contact the one side of the ceramic substrate, the molten metal of aluminum is injected into the mold so as to contact the other side of the ceramic substrate, to form an aluminum base plate on the other side of the ceramic substrate to bond the aluminum base plate directly to the ceramic substrate.

4. A method for producing a metal/ceramic bonding substrate as set forth in claim 1 , wherein the ceramic substrate is a ceramic substrate of aluminum nitride, and the aluminum has a purity of 99.9% by weight or more.

5. A method for producing a metal/ceramic bonding substrate as set forth in claim 1 , wherein the injecting and cooling of the molten metal are carried out while pressurizing the molten metal.

6. A method for producing a metal/ceramic bonding substrate as set forth in claim 1 , wherein said inert gas is nitrogen gas or argon gas.

7. A method for producing a metal/ceramic bonding substrate as set forth in claim 1 , wherein the metal/ceramic bonding substrate has an oxide layer which is formed in a bonded interface between the aluminum plate and the ceramic substrate and which has a maximum thickness of 4 nm or less, the metal/ceramic bonding substrate having a bonding strength of 330 N/cm or more between the aluminum plate and the ceramic substrate.

Assignees

• Dowa Metaltech Co Ltd

Inventors

• Osanai Hideyo

Classifications

• H10W70/6875

  being on a metallic substrate, e.g. insulated metal substrates [IMS] · CPC title

• H10W70/05

  of insulating or insulated package substrates, or of interposers, or of redistribution layers (manufacture or treatment of leadframes H10W70/04) · CPC title

• H10W40/255 Primary

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• C04B37/021

  in a direct manner, e.g. direct copper bonding [DCB] · CPC title

• B22D19/04

  for joining parts · CPC title