BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load
US-12494441-B2 · Dec 9, 2025 · US
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Nardi Patrick patents
Nardi Patrick is listed as an inventor on 20 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nardi Patrick |
| Total patents | 20 |
| First publication | Jan 5, 2016 |
| Latest publication | Dec 9, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
N-ball second level interconnect package architecture
US-2025105114-A1 · Mar 27, 2025 · US
Method and Stiffeners for Package Level Warpage Modulation
US-2025062168-A1 · Feb 20, 2025 · US
Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE
US-12183688-B2 · Dec 31, 2024 · US
Bga stiffener attachment with low eolife adhesive strength at high solder joint stress area generated from enabling load
US-2023307379-A1 · Sep 28, 2023 · US
Integrated circuit die package stiffeners of metal alloys having exceptionally high cte
US-2022285288-A1 · Sep 8, 2022 · US
Foam composite
US-10651108-B2 · May 12, 2020 · US
Electronic package that includes multi-layer stiffener
US-10535615-B2 · Jan 14, 2020 · US
Constrained cure component attach process for improved IC package warpage control
US-10290569-B2 · May 14, 2019 · US
Constrained cure component attach process for improved ic package warpage control
US-2019103345-A1 · Apr 4, 2019 · US
Recent patents
Latest publications not already listed above.
Electronic package and method of connecting a first die to a second die to form an electronic package
US-9887104-B2 · Feb 6, 2018 · US
Electronic package that includes multi-layer stiffener
US-2018033741-A1 · Feb 1, 2018 · US
Panel level fabrication of package substrates with integrated stiffeners
US-9832860-B2 · Nov 28, 2017 · US
Cooling of electronics using folded foil microchannels
US-2017186667-A1 · Jun 29, 2017 · US
Adaptive tcb by data feed forward
US-2017154828-A1 · Jun 1, 2017 · US
Methods of forming serpentine thermal interface material and structures formed thereby
US-9418912-B2 · Aug 16, 2016 · US
Panel level fabrication of package substrates with integrated stiffeners
US-2016095209-A1 · Mar 31, 2016 · US
Methods of forming serpentine thermal interface material and structures formed thereby
US-2016079141-A1 · Mar 17, 2016 · US
Electronic package and method of connecting a first die to a second die to form an electronic package
US-2016005672-A1 · Jan 7, 2016 · US
Methods of forming serpentine thermal interface material and structures formed thereby
US-9230877-B2 · Jan 5, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 20 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W42/121 | 11 |
| H10W76/40 | 9 |
| H01L23/562 | 8 |
| H10W90/701 | 7 |
| H01L23/49816 | 6 |