Constrained cure component attach process for improved IC package warpage control

Patent metadata

Field	Value
Publication number	US-10290569-B2
Application number	US-201715721707-A
Country	US
Kind code	B2
Filing date	Sep 29, 2017
Priority date	Sep 29, 2017
Publication date	May 14, 2019
Grant date	May 14, 2019

Abstract

An apparatus, comprising a first platform comprising a first working surface having a first non-planar portion; and a second platform comprising a second working surface having a second non-planar portion, wherein: the second working surface is opposite the first working surface, a distance between the first working surface and the second working surface is adjustable, the first non-planar portion comprises a first curved portion, and the second non-planar portion comprises a second curved portion opposite the first curved portion.

First claim

We claim:

1. An apparatus, comprising:
a first platform comprising a first working surface having a first non-planar portion, wherein the first non-planar portion comprises a first curved portion extending from the first platform; and
a second platform comprising a second working surface having a second non-planar portion, wherein the second non-planar portion comprises a second curved portion recessed into the second platform, wherein the second curved portion is opposite the first curved portion, and wherein the curvature of the second curved portion is substantially the same as the curvature of the first curved portion, and wherein:
the second working surface is opposite the first working surface,
a distance between the first working surface and the second working surface is adjustable,
the first non-planar portion comprises a protruding portion; and
the second non-planar portion comprises a recessed portion opposite the protruding portion.

2. The apparatus of claim 1 , wherein the first platform comprises a first thermocompression bonding head.

3. The apparatus of claim 2 , wherein the second platform comprises a second thermocompression bonding head opposing the first thermocompression bonding head.

4. The apparatus of claim 3 , wherein the second thermocompression bonding head has a second curved working surface, and wherein the second curved working surface has a curvature that is complimentary to a curvature of the first curved working surface.

5. The apparatus of claim 2 , wherein the first thermocompression bonding head has a first curved working surface.

6. An apparatus, comprising:
a first platform comprising a first working surface having a first non-planar portion; and
a second platform comprising a second working surface having a second non-planar portion, wherein:
the second working surface is opposite the first working surface,
a distance between the first working surface and the second working surface is adjustable,
the first non-planar portion comprises a protruding portion, and
the second non-planar portion comprises a recessed portion opposite the protruding portion, wherein the second non-planar portion comprises three protrusions comprising a middle protrusion equidistant between two peripheral protrusions, and wherein a z-height of the two peripheral protrusions is larger than a z-height of the middle protrusion.

7. The apparatus of claim 6 , wherein the first non-planar portion comprises one protrusion opposite the middle protrusion of the second non-planar portion.

8. The apparatus of claim 6 , wherein the second non-planar portion comprises two protrusions separated by a recessed portion of the second non-planar portion.

9. The apparatus of claim 8 , wherein the first non-planar portion comprises a protrusion opposite the recessed portion of the second non-planar portion.

10. An apparatus, comprising:
a first platform comprising a first working surface having a first non-planar portion; and
a second platform comprising a second working surface having a second non-planar portion, wherein:
the second working surface is opposite the first working surface,
a distance between the first working surface and the second working surface is adjustable,
the first non-planar portion comprises a protruding portion, and
the second non-planar portion comprises a recessed portion opposite the protruding portion, wherein the first platform comprises a first cavity, and wherein the first platform comprises ports extending from an exterior wall of the first platform to the first cavity.

11. The apparatus of claim 10 , wherein the second platform comprises a protrusion extending from the second non-planar portion opposite the first cavity of the first platform.

12. The apparatus of claim 11 , wherein the protrusion is a stylus.

13. The apparatus of claim 10 , wherein the second platform comprises a second cavity opposite the first cavity of the first platform.

14. The apparatus of claim 13 , wherein the second cavity is a pressure chamber.

15. The apparatus of claim 10 , wherein the ports are vacuum ports.

Assignees

• Intel Corp

Inventors

• Yazzie Kyle
• Guthikonda Venkata Suresh R
• Nardi Patrick
• Sankarasubramanian Santosh
• Lin Kevin Y
• Tribolet Leigh M
• Harper John L
• Malatkar Pramod

Classifications

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W74/016 Primary

  using moulds · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title