BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling load

Patent metadata

Field	Value
Publication number	US-12494441-B2
Application number	US-202217703768-A
Country	US
Kind code	B2
Filing date	Mar 24, 2022
Priority date	Mar 24, 2022
Publication date	Dec 9, 2025
Grant date	Dec 9, 2025

Abstract

Embodiments disclosed herein include an electronic package. In an embodiment, the electronic package comprises a package substrate, and a die coupled to the package substrate. In an embodiment, the electronic package further comprises a stiffener on the package substrate surrounding the die. In an embodiment, the stiffener is a ring with one or more corner regions and one or more beams. In an embodiment, each beam is between a pair of corner regions, and the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

First claim

What is claimed is:

1 . An electronic package, comprising:
a package substrate; a die coupled to the package substrate; and a stiffener on the package substrate and laterally surrounding the die, wherein the stiffener is a ring with one or more corner regions and one or more beams, wherein each beam is between a pair of corner regions, and wherein the one or more corner regions have a first thickness and the one or more beams have a second thickness that is greater than the first thickness.

2 . The electronic package of claim 1 , wherein the one or more corner regions have a triangular footprint.

3 . The electronic package of claim 1 , wherein the one or more corner regions have an L-shaped footprint.

4 . The electronic package of claim 1 , wherein each of the one or more corner regions includes a plurality of recesses.

5 . The electronic package of claim 4 , wherein the plurality of recesses are circular recesses.

6 . The electronic package of claim 1 , wherein the second thickness is at least twice the first thickness.

7 . The electronic package of claim 1 , wherein the one or more corner regions have a bottom surface that is substantially coplanar with a bottom surface of the one or more beams.

8 . The electronic package of claim 1 , wherein the one or more corner regions have a top surface that is substantially coplanar with a top surface of the one or more beams.

9 . The electronic package of claim 1 , wherein the one or more corner regions comprises four corner regions.

10 . The electronic package of claim 1 , further comprising:
solder balls under the package substrate.

11 . The electronic package of claim 10 , wherein first solder balls are below the one or more corner regions and second solder balls are below the one or more beams and/or the die.

12 . The electronic package of claim 11 , wherein the first solder balls have a higher volume than the second solder balls.

13 . The electronic package of claim 12 , wherein the first solder balls are not coupled to active circuitry of the electronic package.

14 . The electronic package of claim 1 , wherein the stiffener is coupled to the package substrate by an adhesive.

15 . A stiffener for an electronic package, comprising:
a ring laterally surrounding a die location, wherein the ring includes a top surface and a bottom surface; and recesses into the ring at one or more corner locations of the ring, wherein the recesses reduce a thickness of the ring at the one or more corner locations.

16 . The stiffener of claim 15 , wherein the recesses are formed into the top surface of the ring.

17 . The stiffener of claim 15 , wherein the recesses are formed into the bottom surface of the ring.

18 . The stiffener of claim 15 , wherein the recesses are triangular shaped recesses.

19 . The stiffener of claim 15 , wherein the recesses are L-shaped recesses.

20 . The stiffener of claim 15 , wherein the one or more corner locations each include a plurality of recesses.

21 . The stiffener of claim 20 , wherein the plurality of recesses are circular recesses.

22 . The stiffener of claim 15 , wherein the recess passes through an entire thickness from the top surface to the bottom surface.

23 . An electronic system, comprising:
a board; a package substrate coupled to the board; a die coupled to the package substrate; and a stiffener laterally surrounding the die on the package substrate, wherein the stiffener comprises a ring with corner regions, and wherein the corner regions have a first thickness that is less than a second thickness of beams between the corner regions.

24 . The electronic system of claim 23 , wherein the corner regions include recesses into a top surface of the stiffener.

25 . The electronic system of claim 23 , wherein the corner regions include recesses into a bottom surface of the stiffener.

Assignees

• Intel Corp

Inventors

• Geng Phil
• Nardi Patrick
• Mahajan Ravindranath V
• Xu Dingying David
• Raghavan Prasanna
• Harper John
• Saha Sanjoy
• Jiao Yang

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W42/121 Primary

  protecting against mechanical damage (H10W76/00, H10W74/00 take precedence) · CPC title

• H10W40/10

  Arrangements for heating · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W76/40 Primary

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title