Methods of forming serpentine thermal interface material and structures formed thereby

Patent metadata

Field	Value
Publication number	US-9418912-B2
Application number	US-201514952651-A
Country	US
Kind code	B2
Filing date	Nov 25, 2015
Priority date	Dec 21, 2012
Publication date	Aug 16, 2016
Grant date	Aug 16, 2016

Abstract

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a thermal interface material comprising a thermally conductive serpentine foil located between a first and a second interface material. The serpentine foil may be in a parallel position or a rotated position, in embodiments.

First claim

What is claimed is:

1. A package structure comprising:
a first TIM structure comprising:
a first interface material on a top surface of a device;
a serpentine foil disposed on the first interface material, wherein the serpentine foil comprises a repeating serpentine pattern;
a second interface material on the serpentine foil, wherein an apex portion of the serpentine foil is in contact with at least one of the first and second interface materials;
and
an integrated heat structure (IHS) disposed on the second interface material of the first TIM structure.

2. The structure of claim 1 wherein the device comprises one of a CPU die and a memory die.

3. The structure of claim 1 wherein the integrated heat structure comprises a heat sink.

4. The structure of claim 1 further comprising wherein the serpentine foil material comprises copper.

5. The structure of claim 1 further comprising a system comprising:
a bus communicatively coupled to the package structure; and
an eDRAM communicatively coupled to the bus.

6. The structure of claim 1 further comprising wherein the thermal conductivity of at least one of the first and second TIM structures comprises up to about 100 W/K-m.

7. The structure of claim 1 further comprising wherein a bottom portion of the device comprises a second TIM structure comprising:
a first interface material;
a serpentine foil disposed on the first interface material, wherein the serpentine foil comprises a repeating serpentine pattern; and
a second interface material on the serpentine foil, wherein an apex portion of the serpentine foil is in contact with at least one of the first and second interface materials.

8. The structure of claim 7 further comprising wherein the second TIM structure is disposed on a top surface of a package substrate.

9. The structure of claim 7 further comprising wherein the first TIM comprises one of parallel TIM and a rotated TIM, and the second TIM comprises one of a parallel TIM and a rotated TIM.

10. A package structure comprising:
a first TIM structure comprising:
a first interface material on a top surface of a device;
a serpentine foil disposed on the first interface material, wherein the serpentine foil comprises a repeating serpentine pattern;
a second interface material on the serpentine foil, wherein an apex portion of the serpentine foil is in contact with and extends into at least one of the first and second interface materials;
and
an integrated heat structure (IHS) disposed on the second interface material of the first TIM structure.

11. The structure of claim 10 wherein the device comprises one of a CPU die and a memory die.

12. The structure of claim 10 wherein the integrated heat structure comprises a heat sink.

13. The structure of claim 10 further comprising wherein the serpentine foil material comprises copper.

14. The structure of claim 10 further comprising a system comprising:
a bus communicatively coupled to the package structure; and
an eDRAM communicatively coupled to the bus.

15. The structure of claim 10 further comprising wherein the thermal conductivity of at least one of the first and second TIM structures comprises up to about 100 W/K-m.

16. The structure of claim 10 further comprising wherein a bottom portion of the device comprises a second TIM structure comprising:
a first interface material;

a serpentine foil disposed on the first interface material, wherein the serpentine foil comprises a repeating serpentine pattern; and
a second interface material on the serpentine foil, wherein an apex portion of the serpentine foil is in contact with and extends into at least one of the first and second interface materials.

17. The structure of claim 16 further comprising wherein the second TIM structure is disposed on a top surface of a package substrate.

18. The structure of claim 16 further comprising wherein the first TIM comprises one of parallel TIM and a rotated TIM, and the second TIM comprises one of a parallel TIM and a rotated TIM.

Assignees

• Intel Corp

Inventors

• Nardi Patrick
• Lofgreen Kelly P

Classifications

• F28F3/025

  the means being corrugated, plate-like elements · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W72/241

  Dispositions, e.g. layouts · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title