Foam composite

Patent metadata

Field	Value
Publication number	US-10651108-B2
Application number	US-201615197440-A
Country	US
Kind code	B2
Filing date	Jun 29, 2016
Priority date	Jun 29, 2016
Publication date	May 12, 2020
Grant date	May 12, 2020

Abstract

Devices and methods disclosed herein can include a conductive foam having pores disposed within the conductive foam. The conductive foam can be compressible between an uncompressed thickness and a compressed thickness. The compressed thickness can be ninety-five percent or less of the uncompressed thickness. In one example, a filler can be disposed in the pores of the conductive foam. The filler can include a first thermal conductivity. The first thermal conductivity can be greater than a thermal conductivity of air.

First claim

What is claimed is:

1. A foam composite comprising: a thermally conductive foam including pores disposed within the thermally conductive foam, wherein the thermally conductive foam is greater than fifty-percent copper and compressible between an uncompressed thickness and a compressed thickness; and a filler with a liquid phase disposed in the pores of the thermally conductive foam, wherein the filler includes a first thermal conductivity, the first thermal conductivity is greater than a thermal conductivity of air; and a plurality of thermally conductive particles disposed within the filler, wherein the thermally conductive particles have a second thermal conductivity greater than the first thermal conductivity of the filler; and the filler is a phase change material that adapted to transition between phases within a temperature range of −40° C. to 125° C.

2. The foam composite of claim 1 , wherein the plurality of thermally conductive particles include SiC, Diamond, or ZnO.

3. An electronic assembly comprising: an electronics package including a heat dissipation surface; a heat sink; and a thermally conductive foam compressed between the heat dissipation surface and the heat sink, wherein the thermally conductive foam includes: a plurality of pores disposed within the thermally conductive foam, wherein the thermally conductive foam is greater than fifty-percent copper and compressible between an uncompressed thickness and a compressed thickness, a filler disposed in the pores of the thermally conductive foam, wherein the filler includes a first thermal conductivity, the first thermal conductivity is greater than a thermal conductivity of air; and a plurality of thermally conductive particles disposed within the filler, wherein the thermally conductive particles have a second thermal conductivity greater than the first thermal conductivity of the filler; and the filler is a phase change material that adapted to transition between phases within a temperature range of −40° C. to 125° C.; a continuous path of substantially homogeneous thermally conductive material disposed between a first side and a second side of the thermally conductive foam.

4. The electronic assembly of claim 3 , wherein the plurality of thermally conductive particles include SiC, Diamond, or ZnO.

5. The electronic assembly of claim 3 , further comprising an interface sheet disposed along at least the first side or the second side of the thermally conductive foam, wherein the interface sheet includes a conductive material.

6. A method comprising: inserting a thermally conductive foam between an electronic package and a heat sink; wherein the thermally conductive foam is greater than fifty-percent copper and compressible between an uncompressed thickness and a compressed thickness, a first side of the thermally conductive foam interfaced with a dissipation surface of the electronic package, and a second side of the thermally conductive foam interfaced with the heat sink, wherein the thermally conductive foam includes pores disposed within the thermally conductive foam; and compressing the thermally conductive foam between the electronic package and the heatsink by at least five percent of a thickness of the thermally conductive foam; filling a plurality of pores with a filler, the plurality of pores disposed within a thermally conductive foam, wherein the filler includes a first thermal conductivity greater than a thermal conductivity of air; and a plurality of thermally conductive particles disposed within the filler, wherein the thermally conductive particles have a second thermal conductivity greater than the first thermal conductivity of the filler; and the filler is a phase change material that adapted to transition between phases within a temperature range of −40° C. to 125° C., and the thermally conductive foam is compressible between an uncompressed thickness and a compressed thickness, the compressed thickness being ninety-five percent or less of the uncompressed thickness.

7. The method of claim 6 , further comprising attaching an interface sheet to at least one side of the foam composite.

Assignees

• Intel Corp

Inventors

• Tang Zhizhong
• Jain Syadwad
• Hu Wei
• Schroeder Michael A
• Sidhu Rajen S
• Deppisch Carl L
• Nardi Patrick
• Lofgreen Kelly P
• Dubey Manish

Classifications

• F28F2013/001

  Particular heat conductive materials, e.g. superconductive elements · CPC title

• F28D2021/0029

  Heat sinks · CPC title

• F28F21/04

  of ceramic; of concrete; of natural stone · CPC title

• F28F21/02

  of carbon, e.g. graphite · CPC title

• F28F13/003

  by using permeable mass, perforated or porous materials (F28F13/18 takes precedence) · CPC title