Electronic package that includes multi-layer stiffener

Patent metadata

Field	Value
Publication number	US-10535615-B2
Application number	US-201615548741-A
Country	US
Kind code	B2
Filing date	Feb 12, 2016
Priority date	Mar 3, 2015
Publication date	Jan 14, 2020
Grant date	Jan 14, 2020

Abstract

An electronic package that includes a substrate and a die attached to the substrate. The electronic package further includes a stiffener that is attached to the substrate adjacent to the die. The stiffener is formed of a first layer made from one material and a second layer made from a different material.

First claim

The invention claimed is:

1. An electronic package comprising:
a substrate;
a die attached to the substrate;
a stiffener attached to the substrate adjacent to the die, wherein the stiffener is formed of a first layer made from one material, a second layer made from a different material, and a third layer made from a different material than the first layer and the second layer, wherein the first layer, the second layer and the third layer each laterally surround the die, wherein the stiffener does not extend over an upper surface of the die.

2. The electronic package of claim 1 , wherein the first material has a first coefficient of thermal expansion (CTE), the second material has a lower CTE than the first material, and the third material has a lower CTE than the second material, wherein the stiffener has a bending moment that is substantially opposite to a warpage of the electronic package when a temperature change is applied to the electronic package.

3. The electronic package of claim 1 , wherein the stiffener has a substantially uniform cross-section.

4. The electronic package of claim 1 , wherein the first layer is the same size as the second layer and the third layer.

5. The electronic package of claim 1 , wherein the first layer has a different thickness than the second layer and the third layer.

6. The electronic package of claim 1 , wherein the first layer is aluminum and the second layer is stainless steel.

7. An electronic package comprising:
a substrate;
a die attached to the substrate;
a stiffener formed of a first layer made from a conductive material and a second layer made from a different material; and
a conductive adhesive that secures the substrate to the first layer of the stiffener, wherein the substrate includes a ground plane and the conductive adhesive electrically connects the first layer of the stiffener to the ground plane, wherein an upper surface of the substrate includes a solder resist and the ground plane is exposed through the solder resist.

8. The electronic package of claim 7 , wherein the stiffener surrounds the die.

9. The electronic package of claim 7 , wherein the first layer and the second layer are each concentric with the die.

10. The electronic package of claim 7 , wherein the first layer is bonded to the second layer.

11. The electronic package of claim 7 , wherein the stiffener has a substantially uniform cross-section, and wherein the first layer is the same size as the second layer.

12. The electronic package of claim 7 , wherein the first layer is aluminum and the second layer is stainless steel.

13. An electronic package comprising:
a substrate;
a die attached to the substrate, wherein the substrate includes a ground plane and further includes a solder resist on an upper surface of the substrate such that the ground plane is exposed through the upper surface solder resist;
a stiffener attached to the substrate such that the stiffener surrounds the die, wherein the stiffener is formed of an aluminum layer and a second stainless steel layer made from a different material, wherein the stiffener has a substantially uniform cross-section, and wherein the aluminum layer is the same size as the stainless steel layer; and
a conductive adhesive that secures the aluminum layer of the stiffener to the ground plane such that the aluminum layer of the stiffener is electrically connected to the ground plane.

14. The electronic package of claim 13 , wherein the aluminum layer and the second stainless steel layer are each concentric with the die.

Assignees

• Intel Corp

Inventors

• Dubey Manish
• Nekkanty Srikant
• Dias Rajendra C
• Nardi Patrick

Classifications

• H10W76/40

  Fillings or auxiliary members in containers, e.g. centering rings (fillings or auxiliary members for thermal protection or control in containers or encapsulations H10W40/70) · CPC title

• H10W70/65 Primary

  Shapes or dispositions of interconnections · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H10W42/00

  Arrangements for protection of devices (arrangements for thermal protection H10W40/00) · CPC title

• H10W70/66

  Conductive materials thereof · CPC title