Method of plating and apparatus for plating
US-12516437-B2 · Jan 6, 2026 · US
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Nagai Mizuki patents
Nagai Mizuki is listed as an inventor on 61 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nagai Mizuki |
| Total patents | 61 |
| First publication | Jul 23, 2015 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Anode holder, and plating apparatus
US-12410535-B2 · Sep 9, 2025 · US
Method of plating and apparatus for plating
US-2025075364-A1 · Mar 6, 2025 · US
Plating method and plating apparatus
US-12221714-B2 · Feb 11, 2025 · US
Plating method, insoluble anode for plating, and plating apparatus
US-12157951-B2 · Dec 3, 2024 · US
Plating apparatus and plating method
US-2024254648-A1 · Aug 1, 2024 · US
Plating method and plating apparatus
US-2024209542-A1 · Jun 27, 2024 · US
Substrate processing apparatus
US-12020954-B2 · Jun 25, 2024 · US
Plating apparatus
US-2024183057-A1 · Jun 6, 2024 · US
Plating apparatus
US-11725297-B2 · Aug 15, 2023 · US
Recent patents
Latest publications not already listed above.
Plating apparatus and plating method
US-2023203701-A1 · Jun 29, 2023 · US
Regulation plate, anode holder, and substrate holder
US-11686009-B2 · Jun 27, 2023 · US
Plating method and plating apparatus
US-11566339-B2 · Jan 31, 2023 · US
Method of plating, apparatus for plating, and non-volatile storage medium that stores program
US-11542629-B2 · Jan 3, 2023 · US
Electroplating apparatus and cleaning method in electroplating apparatus
US-11492721-B2 · Nov 8, 2022 · US
Anode holder, and plating apparatus
US-2022307153-A1 · Sep 29, 2022 · US
Plating method, insoluble anode for plating, and plating apparatus
US-2022228285-A1 · Jul 21, 2022 · US
Method of plating, apparatus for plating, and non-volatile storage medium that stores program
US-2022186398-A1 · Jun 16, 2022 · US
Plating method and plating apparatus
US-2022170175-A1 · Jun 2, 2022 · US
Regulation plate, anode holder, and substrate holder
US-2022154363-A1 · May 19, 2022 · US
Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate
US-11319642-B2 · May 3, 2022 · US
Plating apparatus
US-2022119981-A1 · Apr 21, 2022 · US
Plating method and plating apparatus
US-11286577-B2 · Mar 29, 2022 · US
Substrate holder and plating device
US-11280020-B2 · Mar 22, 2022 · US
Regulation plate, anode holder, and substrate holder
US-11268207-B2 · Mar 8, 2022 · US
Substrate processing apparatus
US-2021391190-A1 · Dec 16, 2021 · US
Plating apparatus and plating method
US-11066755-B2 · Jul 20, 2021 · US
Substrate holder, a method for holding a substrate with a substrate holder, and a plating apparatus
US-11037791-B2 · Jun 15, 2021 · US
Plating method and plating apparatus
US-2021164125-A1 · Jun 3, 2021 · US
Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate
US-2021148000-A1 · May 20, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Ebara Corp | 61 |
| Yasuda Shingo | 1 |
| Kuriyama Fumio | 1 |
| Shimoyama Masashi | 1 |
| Nagai Mizuki | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 55 |
| C25D21/12 | 41 |
| C25D17/06 | 39 |
| C25D17/00 | 35 |
| C25D17/008 | 29 |