Plating method and plating apparatus

Patent metadata

Field	Value
Publication number	US-11566339-B2
Application number	US-202117167829-A
Country	US
Kind code	B2
Filing date	Feb 4, 2021
Priority date	Jan 17, 2014
Publication date	Jan 31, 2023
Grant date	Jan 31, 2023

Abstract

A plating method capable of controlling a concentration of an additive within a proper range during plating of a substrate is disclosed. The plating method includes: disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive; applying a voltage between the anode and the substrate for filling the via-hole with metal; measuring the voltage applied to the substrate; calculating an amount of change in the voltage per predetermined time; and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range.

First claim

What is claimed is:

1. A plating method comprising:
disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive;
applying a voltage between the anode and the substrate for filling the via-hole with metal;
measuring the voltage applied to the substrate;
calculating an amount of change in the voltage per predetermined time; and
determining a first point of time at which the amount of change in the voltage per predetermined time exceeds a predetermined first threshold value;
determining a second point of time at which the amount of change in the voltage per predetermined time decreases below a predetermined second threshold value;
waiting a preset time after the second point of time; and then
after waiting stopping application of the voltage.

2. The plating method according to claim 1 , wherein the preset time includes zero seconds.

3. The plating method according to claim 1 , further comprising:
increasing a current density on the substrate when the amount of change in the voltage exceeds the predetermined first threshold value.

Assignees

• Ebara Corp

Inventors

• Tamari Yusuke
• Owatari Akira
• Nagai Mizuki
• Yasuda Shingo

Classifications

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D5/02

  Electroplating of selected surface areas · CPC title

• C25D21/14 Primary

  Controlled addition of electrolyte components · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title