Method for determining location of power feeding point in electroplating apparatus and electroplating apparatus for plating rectangular substrate

Patent metadata

Field	Value
Publication number	US-11319642-B2
Application number	US-202117158390-A
Country	US
Kind code	B2
Filing date	Jan 26, 2021
Priority date	Nov 22, 2017
Publication date	May 3, 2022
Grant date	May 3, 2022

Abstract

To optimize a location of a power feeding point with the use of a square substrate. There is disclosed a method for determining a location of a power feeding point in an electroplating apparatus. The electroplating apparatus is configured to plate a rectangular substrate having a substrate area of S. The rectangular substrate has opposed two sides coupled to a power supply. The rectangular substrate has a length L of the sides coupled to the power supply and a length W of sides not coupled to the power supply meeting a condition of 0.8×L≤W≤L. The method includes determining a number N of the power feeding points according to the substrate area S.

First claim

What is claimed is:

1. An electroplating apparatus for plating a rectangular substrate, the electroplating apparatus comprising:
a substrate holder that holds the substrate with opposed two sides of the substrate being coupled to a power supply;
an auxiliary electrode configured to assist the plating on the substrate; and
at least one power feeding element configured to supply the auxiliary electrode with an electric power from the power supply,
wherein the rectangular substrate having a length L of the sides coupled to the power supply and a length W of sides not coupled to the power supply meeting a condition of:
0.8 ×L≤W≤L

wherein
L≥169 mm; and
W≥211 mm,

wherein the at least one power feeding element is coupled to the auxiliary electrode at a center of the auxiliary electrode,
wherein the at least one power feeding element is further coupled to the auxiliary electrode by at least one point among (0, ±C y ), (±C x , 0), and (±C x , ±C y ),
wherein C y using mm as a unit is a value meeting conditions of:
0.3224 L− 9.2≤ C y ; and

C y ≤0.3224 L+ 30.8, while

and wherein C x using mm as a unit meets conditions of:
0.5727 W− 120.8≤ C x ; and

C x ≤0.5727 W− 100.8,

where a direction along the sides of the substrate not coupled to the power supply is an x-direction, a direction along the sides of the substrate coupled to the power supply is a y-direction, and a coordinate of a coupling portion of the at least one power feeding element with the auxiliary electrode at the center of the auxiliary electrode is (0, 0).

2. The electroplating apparatus according to claim 1 , wherein
the substrate has a substrate area S larger than 0.14 m 2 and 0.27 m 2 or less, and
the at least one power feeding element is coupled to the auxiliary electrode at three points of (0, 0) and (0, ±C y ).

3. The electroplating apparatus according to claim 1 , wherein
the substrate has a substrate area S larger than 0.23 m 2 and 0.33 m 2 or less, and
the at least one power feeding element is coupled to the auxiliary electrode at five points of (0, 0), (0, ±C y ), and (±C x , 0).

4. The electroplating apparatus according to claim 1 , wherein
the substrate has a substrate area S larger than 0.29 m 2 and 0.34 m 2 or less, and
the at least one power feeding element is coupled to the auxiliary electrode at seven points of (0, 0), (0, ±C y ), and (±C x , ±C y ).

5. The electroplating apparatus according to claim 1 , wherein
the substrate has a substrate area S larger than 0.36 m 2 , and
the at least one power feeding element is coupled to the auxiliary electrode at nine points of (0, 0), (0, ±C y ), (±C x , 0), and (±C x , ±C y ).

Assignees

• Ebara Corp

Inventors

• Shamoto Mitsuhiro
• Nagai Mizuki
• Takahashi Naoto

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W20/057

  by selectively depositing, e.g. by using selective CVD or plating · CPC title

• H10W72/0112

  Apparatus for manufacturing bump connectors · CPC title