Regulation plate, anode holder, and substrate holder

Patent metadata

Field	Value
Publication number	US-11268207-B2
Application number	US-201816630369-A
Country	US
Kind code	B2
Filing date	Jul 6, 2018
Priority date	Jul 11, 2017
Publication date	Mar 8, 2022
Grant date	Mar 8, 2022

Abstract

To partially or locally control a plating film thickness on a polygonal substrate. There is provided a regulation plate for adjusting a current between an anode and the polygonal substrate. This regulation plate includes a main body that has an edge forming a polygonal opening through which the current passes and an attachable/detachable shielding member to shield at least a part of the polygonal opening.

First claim

The invention claimed is:

1. A regulation plate for adjusting a current between an anode and a polygonal substrate, the regulation plate comprising:
a main body that has an edge forming a polygonal opening through which the current passes;
an attachable/detachable shielding member to shield at least a part of the polygonal opening; and
a shaft-shaped supporting member disposed to be across the polygonal opening, wherein
the shielding member includes a shielding plate attachably/detachably mounted on the supporting member.

2. The regulation plate according to claim 1 , wherein
the shielding member includes a partition member configured to divide the polygonal opening into a plurality of compartments.

3. The regulation plate according to claim 1 , wherein
the shielding plate is attachably/detachably mounted on the supporting member without contacting the main body.

4. The regulation plate according to claim 2 , wherein
the partition member partitions the polygonal opening to form a plurality of openings,
the regulation plate further includes a shaft-shaped supporting member disposed to be across at least one of the plurality of openings, and
the shielding member includes a shielding plate attachably/detachably mounted on the supporting member.

5. A regulation plate for adjusting a current between an anode and a polygonal substrate, the regulation plate comprising:
a main body that has an edge forming a polygonal opening through which the current passes; and
an attachable/detachable shielding member to shield at least a part of the polygonal opening, wherein
the shielding member includes a partition member configured to divide the polygonal opening into a plurality of compartments,
the partition member partitions the polygonal opening to form a plurality of openings,
the regulation plate further includes a shaft-shaped supporting member disposed to be across at least one of the plurality of openings, and
the shielding member includes a shielding plate attachably/detachably mounted on the supporting member.

Assignees

• Ebara Corp

Inventors

• Shimomura Naoki
• Nagai Mizuki

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D5/022

  using masking means · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title