Anode holder, and plating apparatus

Patent metadata

Field	Value
Publication number	US-12410535-B2
Application number	US-202017616811-A
Country	US
Kind code	B2
Filing date	May 28, 2020
Priority date	Jun 10, 2019
Publication date	Sep 9, 2025
Grant date	Sep 9, 2025

Abstract

Provided are an anode holder capable of reducing consumption of an additive in a plating apparatus, and a plating apparatus. An anode holder for holding an anode for use in a plating apparatus is provided, and the anode holder includes an inner space formed in the anode holder, to house the anode, a mask including a plurality of holes, and configured to cover a front surface of the inner space, and a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space.

First claim

The invention claimed is:

1. An anode holder for holding an insoluble anode for use in a plating apparatus, the anode holder comprising:
an inner space formed in the anode holder, to house the insoluble anode;
a mask comprising a plate-shaped member including a plurality of holes, and configured to cover a front surface of the inner space; and
a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers the front surface of the inner space, wherein
the inner space and an outer space of the anode holder are divided by the diaphragm and the mask,
the mask is fixed on a side opposite to the inner space with respect to the diaphragm, and
the diaphragm is sandwiched between the mask and the insoluble anode to be fixed to the mask, and is placed in direct physical contact with the insoluble anode.

2. The anode holder according to claim 1 , wherein the diaphragm and the mask are closely connected to each other via a closely connecting layer.

3. The anode holder according to claim 1 , wherein the diaphragm and the mask are bonded or welded to each other.

4. The anode holder according to claim 1 , wherein an opening ratio by the plurality of holes is equal to or more than 2% and equal to or less than 25%.

5. The anode holder according to claim 1 , further comprising
a base body supporting at least one of the diaphragm and the mask, wherein
the diaphragm and the mask are fixed to each other in a second region that is different from a first region where the at least one of the diaphragm and the mask is supported by the base body.

6. The anode holder according to claim 1 , wherein each of the plurality of holes is tapered with a diameter increasing away from the diaphragm.

7. The anode holder according to claim 1 , wherein the diaphragm and the mask are arranged to extend in a vertical direction of the plating apparatus.

8. The anode holder according to claim 1 , wherein the mask is made of a resin.

9. The anode holder according to claim 1 , wherein the diaphragm is an ion exchange membrane or a neutral diaphragm.

10. A plating apparatus comprising:
a plating solution tank;
a mask comprising a plate-shaped member including a plurality of holes, and dividing the plating solution tank into an anode tank in which an insoluble anode is disposed and a cathode tank in which a cathode is disposed; and
a diaphragm, at least part of the diaphragm being fixed to the mask in a region of the mask that covers a front surface of the anode tank, wherein
the anode tank and the cathode tank are divided by the diaphragm and the mask,
the mask is fixed on a side of the cathode tank with respect to the diaphragm, and
the diaphragm is sandwiched between the mask and the insoluble anode to be fixed to the mask, and is placed in direct physical contact with the insoluble anode.

Assignees

• Ebara Corp

Inventors

• Kanda Hiroyuki
• Ikeda Hironari
• Kimura Masaaki
• Nagai Mizuki

Classifications

• C25D17/008

  Current shielding devices · CPC title

• C25D17/10 Primary

  Electrodes {, e.g. composition, counter electrode} · CPC title

• C25D17/02

  Tanks; Installations therefor · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D21/04

  Removal of gases or vapours {; Gas or pressure control} · CPC title