Substrate holder, a method for holding a substrate with a substrate holder, and a plating apparatus

Patent metadata

Field	Value
Publication number	US-11037791-B2
Application number	US-201816142343-A
Country	US
Kind code	B2
Filing date	Sep 26, 2018
Priority date	Dec 26, 2014
Publication date	Jun 15, 2021
Grant date	Jun 15, 2021

Abstract

To suppress thicknesses of a plating film of dies adjacent to a portion in which patterns are not formed on a resist, and improve uniformity of a plated metal layer thickness in a substrate surface. A substrate holder according to the present invention has: a holding surface 57 for holding a substrate; a second holding member 60 configured to have an opening part 63 for exposing the holding surface 57, and to press the substrate placed on the holding surface 57 against the holding surface 57 to thereby hold the substrate; and a shielding plate 65 configured to protrude to an inside of the opening part 63 of the second holding member 60 in a radial direction and to shield a part of the holding surface 57. The shielding plate 65 is configured to be movable along the opening part 63.

First claim

What is claimed is:

1. A method for plating a substrate held by a substrate holder, comprising the steps of:
placing the substrate between a substrate holding surface and a substrate holding part of the substrate holder, and pressing the substrate against the substrate holding surface by the substrate holding part while exposing the substrate to thereby hold the substrate;
moving along an edge of an opening part a shielding part that protrudes to an inside of the opening part of the substrate holding part and shields a part of the substrate placed on the substrate holding surface, the shielding part being attached to the substrate holding part;
positioning the shielding part to shield only a portion in which patterns are not formed on a resist; and
plating the substrate with the shielding part and the substrate fixed.

2. The method according to claim 1 , further comprising,
moving the shielding part in the radial direction of the opening part.

3. The method according to claim 1 , wherein the shielding part has a protruding part that protrudes toward the substrate holding surface.

4. The method according to claim 3 , wherein the protruding part has a tapered surface in a surface on the inside in the radial direction of the opening part, a thickness of the tapered surface becoming smaller toward the substrate holding surface.

5. The method according to claim 1 , wherein
the substrate holding part has a groove formed along the edge of the opening part, and
the shielding part has an engagement part that engages with the groove,
the method further comprising,
sliding the engagement part of the shielding part along the groove.

6. The method according to claim 1 , wherein moving the shielding part comprises moving the shielding part only in a peripheral direction along the edge of the opening part.

7. An apparatus for plating a substrate, comprising:
a plating bath configured to house the substrate and an anode; and
an intermediate mask arranged between the substrate and the anode, wherein
the intermediate mask has a plurality of edge parts that form an opening through which an electric field from the anode to the substrate is made to pass, and wherein
the apparatus further includes a drive mechanism configured to move a position of an inner part of each of the edge parts to an inside of the opening,
the drive mechanism includes airbags, and
the airbags are separate components from the edge parts.

Assignees

• Ebara Corp

Inventors

• Nagai Mizuki
• Shimoyama Masashi

Classifications

• H10P14/47 Primary

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• C25D17/008 Primary

  Current shielding devices · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D17/06

  Suspending or supporting devices for articles to be coated · CPC title

• C25D17/001

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title