Substrate holder and plating device

Patent metadata

Field	Value
Publication number	US-11280020-B2
Application number	US-202016920452-A
Country	US
Kind code	B2
Filing date	Jul 3, 2020
Priority date	Aug 22, 2019
Publication date	Mar 22, 2022
Grant date	Mar 22, 2022

Abstract

According to an embodiment, a substrate holder holds a rectangular substrate and performs electrolytic plating on the substrate. The substrate holder includes a first holding member and a second holding member clamping the substrate between the first holding member and it and having a contact which contacts a peripheral part of the substrate and supplies an electric current to the substrate. The second holding member includes an opening defining a region where an electric field is formed and, at a position farther from the substrate than the opening, a shielding part protruding closer to an inner side than the opening and shielding the peripheral part of a surface of the substrate. The shielding part has a frame shape having a predetermined shielding width in the peripheral part of the substrate, and has, at a corner part thereof, a discontinuous part having a smaller shielding width than surroundings.

First claim

What is claimed is:

1. A substrate holder for holding a substrate in a rectangular shape and performing electrolytic plating on the substrate, the substrate holder comprising:
a first holding member; and
a second holding member having a contact which contacts a peripheral part of the substrate and supplies an electric current to the substrate, wherein the substrate is clamped between the first holding member and the second holding member;
wherein the second holding member comprises:
an opening which defines a region where an electric field is formed; and
at a position farther from the substrate than the opening, a shielding part which protrudes closer to an inner side than the opening and shields the peripheral part of a surface of the substrate,
wherein the shielding part has a frame shape which has a predetermined shielding width in the peripheral part of the substrate, and
wherein the shielding part has, at a corner part of the shielding part, a discontinuous part which has a smaller shielding width than surroundings.

2. The substrate holder according to claim 1 , wherein the shielding part has a hole for draining liquid separately from the discontinuous part.

3. The substrate holder according to claim 1 , further comprising an adjustment component for moving the shielding part along the inner side of the opening in a direction toward or away from the surface of the substrate.

4. The substrate holder according to claim 1 , wherein the shielding part has a step part that gradually increases a distance from the surface of the substrate from the inner side of the opening.

5. The substrate holder according to claim 4 , wherein the shielding part comprises:
a first member having the step part; and
a second member assembled to the first member for adjusting a shielding length to the inner side of the opening.

6. A plating device for performing a plating process on a substrate in a rectangular shape, the plating device comprising:
a plating tank;
an anode disposed in the plating tank;
a substrate holder which holds the substrate and which is disposed in the plating tank to face the anode; and
a regulation plate which is disposed between the anode and the substrate holder in the plating tank, has an opening in a rectangular shape for adjusting an electric field formed between the anode and the substrate, and has a corner mask protruding toward an inner side at a corner part of the opening,
wherein the substrate holder comprises:
a first holding member; and
a second holding member having a contact which contacts a peripheral part of the substrate and supplies an electric current to the substrate, wherein the substrate is clamped between the first holding member and the second holding member;
wherein the second holding member comprises:
an opening which defines a region where the electric field is formed; and
at a position farther from the substrate than the opening, a shielding part which protrudes closer to the inner side than the opening and shields the peripheral part of a surface of the substrate,
wherein the shielding part has a frame shape which has a predetermined shielding width in the peripheral part of the substrate, and
wherein the shielding part has, at a corner part of the shielding part, a discontinuous part which has a smaller shielding width than surroundings.

Assignees

• Ebara Corp

Inventors

• Shimomura Naoki
• Nagai Mizuki

Classifications

• H10P72/7606

  characterised by edge clamping, e.g. clamping ring · CPC title

• H10P72/3206

  the substrate being handled substantially vertically · CPC title

• H10P72/0476 Primary

  comprising at least one plating chamber · CPC title

• C25D21/10

  Agitating of electrolytes; Moving of racks · CPC title

• C25D7/12

  Semiconductors · CPC title