Plating apparatus, plating method, and substrate holder
US-2017058423-A1 · Mar 2, 2017 · US
Regulation plate, anode holder, and substrate holder
US11686009B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11686009-B2 |
| Application number | US-202217590140-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 1, 2022 |
| Priority date | Jul 11, 2017 |
| Publication date | Jun 27, 2023 |
| Grant date | Jun 27, 2023 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
To partially or locally control a plating film thickness on a polygonal substrate. There is provided a regulation plate for adjusting a current between an anode and the polygonal substrate. This regulation plate includes a main body that has an edge forming a polygonal opening through which the current passes and an attachable/detachable shielding member to shield at least a part of the polygonal opening.
First claim
Opening claim text (preview).
The invention claimed is: 1. A substrate holder for holding a polygonal substrate, the substrate holder comprising: a holder main body that has an edge forming a polygonal opening to expose the held polygonal substrate; and an attachable/detachable shielding member to shield at least a part of the polygonal opening, wherein the shielding member includes a partition member configured to divide the polygonal opening into a plurality of compartments, the partition member is mounted across from one side of the edge of the polygonal opening to the other side edge to form a non-uniform film thickness. 2. The substrate holder according to claim 1 , further comprising a shaft-shaped supporting member disposed to be across the polygonal opening, wherein the shielding member includes a shielding plate attachably/detachably mounted on the supporting member. 3. The substrate holder according to claim 2 , wherein the shielding plate is attachably/detachably mounted on the supporting member without contacting the holder main body. 4. The substrate holder according to claim 1 , wherein the partition member partitions the polygonal opening to form a plurality of openings, the substrate holder further includes a shaft-shaped supporting member disposed to be across at least one of the plurality of openings, and the shielding member includes a shielding plate attachably/detachably mounted on the supporting member. 5. The substrate holder according to claim 1 , wherein the partition member is a straight rod-shaped member.
Assignees
Inventors
Classifications
Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title
- C25D17/008Primary
Current shielding devices · CPC title
Current directing devices · CPC title
Suspending or supporting devices for articles to be coated · CPC title
Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11686009B2 cover?
- To partially or locally control a plating film thickness on a polygonal substrate. There is provided a regulation plate for adjusting a current between an anode and the polygonal substrate. This regulation plate includes a main body that has an edge forming a polygonal opening through which the current passes and an attachable/detachable shielding member to shield at least a part of the polygon…
- Who is the assignee on this patent?
- Ebara Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D17/008. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Jun 27 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).