Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus
US-11401612-B2 · Aug 2, 2022 · US
This page is not indexed by search engines while we improve data quality.
Moriyama Terumasa patents
Moriyama Terumasa is listed as an inventor on 15 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Moriyama Terumasa |
| Total patents | 15 |
| First publication | Feb 19, 2015 |
| Latest publication | Aug 2, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Surface treatment metal powder for laser sintering
US-2019240729-A1 · Aug 8, 2019 · US
Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
US-10332756-B2 · Jun 25, 2019 · US
Carrier-attached copper foil, laminate, method for manufacturing printed-wiring board and method for manufacturing electronic device
US-10123433-B2 · Nov 6, 2018 · US
Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board
US-2018264783-A1 · Sep 20, 2018 · US
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus
US-2018255646-A1 · Sep 6, 2018 · US
Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus
US-2018228029-A1 · Aug 9, 2018 · US
Copper foil with carrier
US-9788423-B2 · Oct 10, 2017 · US
Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board
US-9578741-B2 · Feb 21, 2017 · US
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
US-2017032978-A1 · Feb 2, 2017 · US
Recent patents
Latest publications not already listed above.
Carrier-Attached Copper Foil, Laminate, Method For Manufacturing Printed-Wiring Board And Method For Manufacturing Electronic Device
US-2017034926-A1 · Feb 2, 2017 · US
Copper foil with carrier, laminate, method of producing printed wiring board, and method of producing electronic devices
US-2016374205-A1 · Dec 22, 2016 · US
Copper foil with carrier
US-2016242281-A1 · Aug 18, 2016 · US
Copper foil for printed wiring board, method for producing said copper foil, resin substrate for printed wiring board and printed wiring board
US-9028972-B2 · May 12, 2015 · US
Copper Foil with Carrier, Method of Producing Same, Copper Foil with Carrier for Printed Wiring Board, and Printed Wiring Board
US-2015047884-A1 · Feb 19, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Jx Nippon Mining & Metals Corp | 15 |
| Kohiki Michiya | 1 |
| Moriyama Terumasa | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B32B15/08 | 13 |
| H05K1/09 | 13 |
| C25D3/38 | 13 |
| B32B15/20 | 13 |
| H05K2201/0355 | 11 |