Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus

Patent metadata

Field	Value
Publication number	US-2018255646-A1
Application number	US-201815907385-A
Country	US
Kind code	A1
Filing date	Feb 28, 2018
Priority date	Mar 3, 2017
Publication date	Sep 6, 2018
Grant date	—

Abstract

To provide a surface-treated copper foil that is capable of favorably decreasing the transmission loss even used in a high frequency circuit board and has an improved peel strength on adhering to an insulating substrate, such as a resin. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average length of roughening particles of 0.030 μm or more and 0.8 μm or less, the roughening treatment layer has an average number of gap portions between the adjacent roughening particles of 20/100 μm or more and 1,700/100 μm or less, and the roughening treatment layer has a total frequency of an overlap frequency and a contact frequency of roughening particles of 120/100 μm or less.

First claim

1 . A surface-treated copper foil comprising a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein
the roughening treatment layer has an average length of roughening particles of 0.030 μm or more and 0.8 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average number of gap portions between the adjacent roughening particles of 20/100 μm or more and 1,700/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, and the roughening treatment layer has a total frequency of an overlap frequency and a contact frequency of roughening particles of 120/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer.

2 . The surface-treated copper foil according to claim 1 , wherein the roughening treatment layer has an average length of gap portions between the adjacent roughening particles of 0.01 μm or more and 1.5 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer.

3 . The surface-treated copper foil according to claim 1 , wherein the roughening treatment layer has an average number of roughening particles of 50/100 μm or more on observation of the copper foil from the side of the surface having the roughening treatment layer.

4 . The surface-treated copper foil according to claim 1 , wherein the roughening treatment layer has an average length of roughening particles of 0.01 μm or more and 0.9 μm or less on observation of a cross sectional surface in parallel to the thickness direction of the copper foil.

5 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer contains Co, and the surface treatment layer has a content ratio of Co of 15% by mass or less (excluding 0% by mass).

6 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer has a total deposited amount of from 1.0 to 5.0 g/m 2 .

7 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer contains Ni, and the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass).

8 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer has a deposited amount of Co of from 30 to 2,000 μg/dm 2 .

9 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer contains Ni, and the surface treatment layer has a deposited amount of Ni of from 10 to 1,000 μg/dm 2 .

10 . The surface-treated copper foil according to claim 1 , wherein
the roughening treatment layer has an average length of roughening particles of 0.065 μm or more and 0.585 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average number of gap portions between the adjacent roughening particles of 250/100 μm or more and 1,200/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has a total frequency of an overlap frequency and a contact frequency of roughening particles of 85/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average length of gap portions between the adjacent roughening particles of 0.030 μm or more and 0.200 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, and the roughening treatment layer has an average number of roughening particles of 190/100 μm or more and 1,700/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, and the roughening treatment layer has an average length of roughening particles of 0.150 μm or more and 0.45 μm or less on observation of a cross sectional surface in parallel to the thickness direction of the copper foil.

11 . The surface-treated copper foil according to claim 1 , wherein
the roughening treatment layer has an average length of roughening particles of 0.079 μm or more and 0.420 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average number of gap portions between the adjacent roughening particles of 365/100 μm or more and 770/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has a total frequency of an overlap frequency and a contact frequency of roughening particles of 65/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average length of gap portions between the adjacent roughening particles of 0.065 μm or more and 0.150 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, and the roughening treatment layer has an average number of roughening particles of 400/100 μm or more and 1,200/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, and the roughening treatment layer has an average length of roughening particles of 0.170 μm or more and 0.35 μm or less on observation of a cross sectional surface in parallel to the thickness direction of the copper foil.

12 . The surface-treated copper foil according to claim 1 , wherein
the roughening treatment layer has an average length of roughening particles of 0.100 μm or more and 0.205 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average number of gap portions between the adjacent roughening particles of 470/100 μm or more and 740/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has a total frequency of an overlap frequency and a contact frequency of roughening particles of 45/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, the roughening treatment layer has an average length of gap portions between the adjacent roughening particles of 0.068 μm or more and 0.135 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, and the roughening treatment layer has an average number of roughening particles of 500/100 μm or more and 900/100 μm or less on observation of the copper foil from the side of the surface having the roughening treatment layer, and the roughening treatment layer has an average length of roughening particles 0.210 μm or more and 0.30 μm or less on observation of a cross sectional surface in parallel to the thickness direction of the copper foil.

13 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer further contains one or more layer selected from the group consisting of a heat resistant layer, a rust preventing layer, a chromate treatment layer, and a silane coupling treatment layer.

14 . The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil is used in a copper-clad laminated board or a printed wi

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Moriyama Terumasa

Classifications

• H05K2203/066

  Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern · CPC title

• H05K2203/04

  Soldering or other types of metallurgic bonding · CPC title

• H05K2203/05

  Patterning and lithography; Masks; Details of resist · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title

• H05K3/3473

  Plating of solder · CPC title