Surface-Treated Copper Foil, Copper Foil Having Carrier, Laminated Material, Method For Producing Printed Wiring Board, And Method For Producing Electronic Apparatus

Patent metadata

Field	Value
Publication number	US-2018228029-A1
Application number	US-201815888413-A
Country	US
Kind code	A1
Filing date	Feb 5, 2018
Priority date	Feb 7, 2017
Publication date	Aug 9, 2018
Grant date	—

Abstract

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

First claim

1 . A surface-treated copper foil comprising:
a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

2 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer has a total deposited amount of from 1.0 to 5.0 g/m 2 .

3 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer contains Co, and the surface treatment layer has a content ratio of Co of 15% by mass or less (excluding 0% by mass).

4 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer has a deposited amount of Co of from 30 to 2,000 μg/dm 2 .

5 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer contains Ni, and the surface treatment layer has a deposited amount of Ni of from 10 to 1,000 μg/dm 2 .

6 . The surface-treated copper foil according to claim 1 , wherein
the surface treatment layer has a content ratio of Ni of 0.05% by mass or more and 6.0% by mass or less, the outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.2 μm or less, the surface treatment layer has a total deposited amount of from 1.1 to 4.0 g/m 2 , the surface treatment layer has a content ratio of Co of 0.01% by mass or more and 10% by mass or less, the surface treatment layer has a deposited amount of Co of 1,500 μg/dm 2 or less, and the surface treatment layer has a deposited amount of Ni of from 55 to 350 μg/dm 2 .

7 . The surface-treated copper foil according to claim 1 , wherein
the surface treatment layer has a content ratio of Ni of 0.15% by mass or more and 4.8% by mass or less, the outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.1 μm or less, the surface treatment layer has a total deposited amount of from 1.2 to 3.0 g/m 2 , the surface treatment layer has a content ratio of Co of 0.01% by mass or more and 6.5% by mass or less, the surface treatment layer has a deposited amount of Co of 900 μg/dm 2 or less, and the surface treatment layer has a deposited amount of Ni of from 60 to 160 μg/dm 2 .

8 . The surface-treated copper foil according to claim 1 , wherein
the surface treatment layer has a content ratio of Ni of 0.15% by mass or more and 4.8% by mass or less, the outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.1 μm or less, the surface treatment layer has a total deposited amount of from 1.2 to 3.0 g/m 2 , the surface treatment layer has a content ratio of Co of 3% by mass or more and 6.5% by mass or less, the surface treatment layer has a deposited amount of Co of from 100 to 900 μg/dm 2 or less, and the surface treatment layer has a deposited amount of Ni of from 60 to 160 μg/dm 2 .

9 . The surface-treated copper foil according to claim 1 , wherein the surface treatment layer further contains one or more layer selected from the group consisting of a heat resistant layer, a rust preventing layer, a chromate treatment layer, and a silane coupling treatment layer.

10 . The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil is used in a copper-clad laminated board or a printed wiring board for a high frequency circuit board.

11 . A surface-treated copper foil having a resin layer, comprising:
the surface-treated copper foil according to claim 1 , and a resin layer.

12 . A copper foil having a carrier, comprising a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is the surface-treated copper foil according to claim 1 , or a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer.

13 . A laminated material comprising any one of the following items (13-1) to (13-4):
(13-1) the surface-treated copper foil according to claim 1 , (13-2) a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer, (13-3) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is the surface-treated copper foil according to claim 1 , and (13-4) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer.

14 . A laminated material comprising the copper foil having a carrier according to claim 12 , and a resin, wherein a part or the whole of an end face of the copper foil having a carrier is covered with the resin.

15 . A laminated material comprising two of the copper foils having a carrier according to claim 12 .

16 . A method for producing a printed wiring board comprising using any one of the following items (16-1) to (16-4):
(16-1) the surface-treated copper foil according to claim 1 , (16-2) a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer, (16-3) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is the surface-treated copper foil according to claim 1 , and (16-4) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer.

17 . A method for producing a printed wiring board comprising: the following step (17-1) or (17-2):
(17-1) laminating the surface-treated copper foil according to claim 1 or a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer with an insulating substrate to form a copper-clad laminated board, or (17-2) laminating a copper foil having a carrier of the following item (17-2-1) or (17-2-2) with an insulating substrate, and then detaching the carrier of the copper foil having a carrier to form a copper-clad laminated board, (17-2-1) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is the surface-treated copper foil according to claim 1 , or (17-2-2) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer; and forming a circuit by any of a semi-additive method, a subtractive method, a partly additive method, and a modified semi-additive meth

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Moriyama Terumasa

Classifications

• H05K3/28 Primary

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K3/4682

  Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil · CPC title

• C25D3/04

  of chromium · CPC title

• H05K3/4652

  Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern (H05K3/4647 takes precedence) · CPC title

• C25D5/14

  two or more layers being of nickel or chromium, e.g. duplex or triplex layers · CPC title