Copper foil with carrier, method of producing same, copper foil with carrier for printed wiring board, and printed wiring board

Patent metadata

Field	Value
Publication number	US-9578741-B2
Application number	US-201314388381-A
Country	US
Kind code	B2
Filing date	Mar 26, 2013
Priority date	Mar 26, 2012
Publication date	Feb 21, 2017
Grant date	Feb 21, 2017

Abstract

Provided is a copper foil for a printed wiring board including a roughened layer on at least one surface thereof. In the roughened layer, the average diameter D 1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length is 0.2 to 1.0 μm, and the ratio L 1 /D 1 of the particle length L 1 to the average diameter D 1 at the particle bottom is 15 or less. In the copper foil for printed wiring board, when a copper foil for printed wiring having a roughened layer is laminated to a resin and then the copper layer is removed by etching, the sum of areas of holes accounting for the resin roughened surface having unevenness is 20% or more. The present invention involves the development of a copper foil for a semiconductor package substrate that can avoid circuit erosion without causing deterioration in other properties of the copper foil. In particular, an object of the present invention is to provide a copper foil for a printed wiring board and a method of producing the copper foil, in which the adhesion strength between the copper foil and the resin can be enhanced by improvement of the roughened layer of the copper foil.

First claim

The invention claimed is:

1. A copper foil with a carrier comprising a carrier, an intermediate layer, and an ultra-thin copper layer laminated in this order, the ultra-thin copper layer having a thickness smaller than a thickness of the carrier, wherein the ultra-thin copper layer includes a roughened layer on a surface thereof, and the roughened layer comprises particles having an average diameter D 1 at the particle bottom being apart from the bottom of each particle by 10% of the particle length L 1 of 0.2 to 1.0 μm and having a ratio L 1 /D 1 of the particle length L 1 to the average diameter D 1 at the particle bottom of 15 or less.

2. The copper foil with a carrier according to claim 1 , wherein the roughened layer on a surface of the ultra-thin copper layer has a ratio D 2 /D 1 of the average diameter D 2 at the particle middle being apart from the bottom of each particle by 50% of the particle length to the average diameter D 1 at the particle bottom of 1 to 4.

3. The copper foil with a carrier according to claim 2 , wherein the average diameter D 2 at the particle middle is 0.7 μm to 1.5 μm.

4. The copper foil with a carrier according to claim 2 , wherein the ratio D 3 /D 2 of the average diameter D 2 at the particle middle to the average diameter D 3 at the particle end being apart from the bottom of each particle by 90% of the particle length is 0.8 to 1.0.

5. The copper foil with a carrier according to claim 4 , wherein the average diameter D 3 at the particle end is 0.7 μm to 1.5 μm.

6. The copper foil with a carrier according to claim 1 , comprising a resin layer on the roughened layer.

7. The copper foil with a carrier according to claim 1 , further comprising at least one layer selected from the group consisting of heat-resistant/rustproof layers each containing at least one element selected from the group consisting ofzinc, nickel, copper, phosphorus, and cobalt, chromate film layers, and silane coupling agent layers, on the roughened layer.

8. The copper foil with a carrier according to claim 1 , further comprising a heat-resistant/rustproof layer containing at least one element selected from the group consisting of zinc, nickel, copper, phosphorus, and cobalt on the roughened layer and a chromate film layer on the heat-resistant/rustproof layer.

9. The copper foil with a carrier according to claim 1 , further comprising a heat-resistant/rustproof layer containing at least one element selected from the group consisting of zinc, nickel, copper, phosphorus, and cobalt on the roughened layer, a chromate film layer on the heat-resistant/rustproof layer, and a silane coupling agent layer on the chromate film layer.

10. The copper foil with a carrier according to claim 7 , comprising a resin layer on at least one layer selected from the group consisting of the heat-resistant/rustproof layer, the chromate film layer, and the silane coupling agent layer.

11. The copper foil with a carrier according to claim 6 , wherein the resin layer is a resin for adhesion.

12. The copper foil with a carrier according to claim 6 , wherein the resin layer comprises a resin in a semi-cured state.

13. The copper foil with a carrier according to claim 1 , wherein when a resin layer is laminated to the roughened layer of the copper foil, then the carrier and the intermediate layer are peeled from the ultra-thin copper layer, and then the ultra-thin copper layer is removed by etching, the sum of areas of holes on a roughened surface of the resin layer having unevenness transferred from a surface of the roughened layer accounts for 20% or more of the roughened surface of the resin layer.

14. The copper foil with a carrier according to claim 1 , wherein the intermediate layer is at least one layer containing at least one selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al, alloys, hydrates, and oxides thereof, and organic compounds.

15. The copper foil with a carrier according to claim 1 , wherein the intermediate layer comprises, from the carrier side, a monometal layer of one element selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al or an alloy layer of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al; and a layer of a hydrate or oxide of one or more elements selected from the group consisting of Cr, Ni, Co, Fe, Mo, Ti, W, P, Cu, and Al.

16. The copper foil with a carrier according to claim 1 , wherein the intermediate layer comprises Ni and Cr, a deposition amount of Cr of the intermediate layer is 10 μg/dm 2 to 100 μg/dm 2 , and a deposition amount of Ni is 1000 μg/dm 2 to 40000 μg/dm 2 .

17. A copper clad laminate produced using the copper foil with a carrier according to claim 1 .

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Nagaura Tomota
• Kohiki Michiya
• Moriyama Terumasa

Classifications

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

• Y10T428/12903

  Cu-base component · CPC title

• Y10T428/12792

  Zn-base component · CPC title

• H05K3/025

  by transfer of thin metal foil formed on a temporary carrier, e.g. peel-apart copper · CPC title

• C25D5/12

  at least one layer being of nickel or chromium · CPC title