Surface-treated copper foil, copper foil having carrier, laminated material, method for producing printed wiring board, and method for producing electronic apparatus

Patent metadata

Field	Value
Publication number	US-11401612-B2
Application number	US-201815888413-A
Country	US
Kind code	B2
Filing date	Feb 5, 2018
Priority date	Feb 7, 2017
Publication date	Aug 2, 2022
Grant date	Aug 2, 2022

Abstract

To provide a surface-treated copper foil that can favorably decrease the transmission loss even used in a high frequency circuit board, and has improved acid resistance. A surface-treated copper foil containing a copper foil, and a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass), and an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less.

First claim

The invention claimed is:

1. A surface-treated copper foil comprising:
a copper foil, and
a surface treatment layer containing a roughening treatment layer on at least one surface of the copper foil, wherein
the surface treatment layer is deposited directly to the copper foil,
the surface treatment layer contains Ni, the surface treatment layer has a content ratio of Ni of 8% by mass or less (excluding 0% by mass),

a total deposited amount of the surface treatment layer is from 1.0 to 5.0 g/m 2 ,
a deposited amount of Ni of the surface treatment layer is less than 150 μg/dm 2 , and
an outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.4 μm or less,

the surface treatment layer further contains a heat resistant layer and/or a rust preventing layer, and the heat resistant layer and/or the rust preventing layer is a layer containing Ni and one or more elements selected from the group consisting of zinc, tin, cobalt, molybdenum, copper, tungsten, phosphorus, arsenic, chromium, vanadium, titanium, aluminum, gold, silver, a platinum group element, iron, and tantalum,
wherein the content ratio of Ni is defined as ((a deposited amount of Ni (μg/dm 2 ))/(total deposited amount of surface treatment layer (g/m 2 ))×10 −4 (g/m 2 )/(μg/dm 2 ))×100.

2. The surface-treated copper foil according to claim 1 , wherein the surface treatment layer contains Co, and the surface treatment layer has a content ratio of Co of 15% by mass or less (excluding 0% by mass).

3. The surface-treated copper foil according to claim 1 , wherein a deposited amount of Co of the surface treatment layer is from 30 to 2,000 μg/dm 2 .

4. The surface-treated copper foil according to claim 1 , wherein the deposited amount of Ni of the surface treatment layer is from 10 to 140 μg/dm 2 .

5. The surface-treated copper foil according to claim 1 , wherein
the surface treatment layer has a content ratio of Ni of 0.05% by mass or more and 6.0% by mass or less,
the outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.2 μm or less,
a total deposited amount of the surface treatment layer is from 1.1 to 4.0 g/m 2 ,
the surface treatment layer has a content ratio of Co of 0.01% by mass or more and 10% by mass or less,
a deposited amount of Co of the surface treatment layer is 1,500 μg/dm 2 or less, and
the deposited amount of Ni of the surface treatment layer is from 55 to 140 μg/dm 2 .

6. The surface-treated copper foil according to claim 1 , wherein
the surface treatment layer has a content ratio of Ni of 0.15% by mass or more and 4.8% by mass or less,
the outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.1 μm or less,
a total deposited amount of the surface treatment layer has is from 1.2 to 3.0 g/m 2 ,
the surface treatment layer has a content ratio of Co of 0.01% by mass or more and 6.5% by mass or less,
a deposited amount of Co of the surface treatment layer is 900 μg/dm 2 or less, and
the deposited amount of Ni of the surface treatment layer is from 60 to 140 μg/dm 2 .

7. The surface-treated copper foil according to claim 1 , wherein
the surface treatment layer has a content ratio of Ni of 0.15% by mass or more and 4.8% by mass or less,
the outermost surface of the surface treatment layer has a ten-point average roughness Rz of 1.1 μm or less,
a total deposited amount of the surface treatment layer is from 1.2 to 3.0 g/m 2 ,
the surface treatment layer has a content ratio of Co of 3% by mass or more and 6.5% by mass or less,
a deposited amount of Co of the surface treatment layer is from 100 to 900 μg/dm 2 or less, and
the deposited amount of Ni of the surface treatment layer is from 60 to 140 μg/dm 2 .

8. The surface-treated copper foil according to claim 1 , wherein the surface treatment layer further contains one or more layer selected from the group consisting of a chromate treatment layer, and a silane coupling treatment layer.

9. The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil is used in a copper-clad laminated board or a printed wiring board for a high frequency circuit board.

10. A surface-treated copper foil having a resin layer, comprising:
the surface-treated copper foil according to claim 1 , and
a resin layer.

11. A copper foil having a carrier, comprising a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is the surface-treated copper foil according to claim 1 , or a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer.

12. A laminated material comprising any one of the following items (13-1) to (13-4):
(13-1) the surface-treated copper foil according to claim 1 ,
(13-2) a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer,
(13-3) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is the surface-treated copper foil according to claim 1 , and
(13-4) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer.

13. A laminated material comprising the copper foil having a carrier according to claim 11 , and a resin, wherein a part or the whole of an end face of the copper foil having a carrier is covered with the resin.

14. A laminated material comprising two of the copper foils having a carrier according to claim 11 .

15. A method for producing a printed wiring board comprising using any one of the following items (16-1) to (16-4):
(16-1) the surface-treated copper foil according to claim 1 ,
(16-2) a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer,
(16-3) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is the surface-treated copper foil according to claim 1 , and
(16-4) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one surface of the carrier, wherein the ultrathin copper layer is a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer.

16. A method for producing a printed wiring board comprising: the following step (17-1) or (17-2):
(17-1) laminating the surface-treated copper foil according to claim 1 or a surface-treated copper foil having a resin layer, containing the surface-treated copper foil according to claim 1 , and a resin layer with an insulating substrate to form a copper-clad laminated board, or
(17-2) laminating a copper foil having a carrier of the following item (17-2-1) or (17-2-2) with an insulating substrate, and then detaching the carrier of the copper foil having a carrier to form a copper-clad laminated board,
(17-2-1) a copper foil having a carrier, containing a carrier, and an intermediate layer and an ultrathin copper layer on at least one sur

Assignees

• Jx Nippon Mining & Metals Corp

Inventors

• Moriyama Terumasa

Classifications

• H05K2201/0367

  Metallic bump or raised conductor not used as solder bump · CPC title

• C23F1/02 Primary

  Local etching · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title

• H05K1/0242

  Structural details of individual signal conductors, e.g. related to the skin effect · CPC title

• C23F1/14

  Aqueous compositions · CPC title