Dry film
US-2025285785-A1 · Sep 11, 2025 · US
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Malik Sanjay patents
Malik Sanjay is listed as an inventor on 48 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Malik Sanjay |
| Total patents | 48 |
| First publication | Oct 27, 2016 |
| Latest publication | Sep 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Dielectric film-forming composition
US-12338309-B2 · Jun 24, 2025 · US
Polyimides comprising novel indane bis-o-aminophenols, photosensitive compositions, dielectric films, and buffer coatings containing the same
US-2025188223-A1 · Jun 12, 2025 · US
Microelectronic Devices with Good Reliability and Related Compositions and Methods
US-2025046717-A1 · Feb 6, 2025 · US
Bioderived organic solvents
US-2024408590-A1 · Dec 12, 2024 · US
Dielectric Film-Forming Composition
US-2024254268-A1 · Aug 1, 2024 · US
Dielectric film forming composition containing acyl germanium compound
US-2024248400-A1 · Jul 25, 2024 · US
Dielectric film-forming composition
US-11945894-B2 · Apr 2, 2024 · US
Polyimides
US-11939428-B2 · Mar 26, 2024 · US
Photosensitive polyimide compositions
US-11899364-B2 · Feb 13, 2024 · US
Recent patents
Latest publications not already listed above.
Photosensitive polyimide compositions
US-11782344-B2 · Oct 10, 2023 · US
Planarizing process and composition
US-11721543-B2 · Aug 8, 2023 · US
Multilayer structure
US-11634529-B2 · Apr 25, 2023 · US
Dry Film
US-2023053355-A1 · Feb 23, 2023 · US
Dielectric Film-Forming Composition
US-2022127459-A1 · Apr 28, 2022 · US
Dielectric Film Forming Compositions
US-2022017673-A1 · Jan 20, 2022 · US
Dielectric Film-Forming Composition
US-2022002463-A1 · Jan 6, 2022 · US
Polyimides
US-2021355279-A1 · Nov 18, 2021 · US
Photosensitive stacked structure
US-11175582-B2 · Nov 16, 2021 · US
Metal Deposition Processes
US-2021287939-A1 · Sep 16, 2021 · US
Polyimides
US-11061327-B2 · Jul 13, 2021 · US
Planarizing Process and Composition
US-2021104398-A1 · Apr 8, 2021 · US
Dielectric film forming composition
US-10875965-B2 · Dec 29, 2020 · US
Polyimides
US-10793676-B2 · Oct 6, 2020 · US
Polyimide compositions
US-10781341-B2 · Sep 22, 2020 · US
Polyimides
US-2020262978-A1 · Aug 20, 2020 · US
Photosensitive polyimide compositions
US-2020218152-A1 · Jul 9, 2020 · US
Cleaning composition
US-10696932-B2 · Jun 30, 2020 · US
Polymer and thermosetting composition containing same
US-10604628-B2 · Mar 31, 2020 · US
Dielectric film forming composition
US-10563014-B2 · Feb 18, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Fujifilm Electronic Mat Usa Inc | 48 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C09D179/08 | 31 |
| C08G73/1067 | 29 |
| C08G73/1039 | 26 |
| C08G73/1014 | 21 |
| C08G73/1042 | 21 |