Polyimides

US11939428B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11939428-B2
Application numberUS-202117391298-A
CountryUS
Kind codeB2
Filing dateAug 2, 2021
Priority dateOct 25, 2016
Publication dateMar 26, 2024
Grant dateMar 26, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compound containing a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. Each variable in the above formulas is defined in the specification.

First claim

Opening claim text (preview).

What is claimed is: 1. A polyimide polymer, comprising the reaction product of components (a), (b), (c), and (d), wherein components (a), (b), (c), and (d) are: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib): wherein each of R 1 , R 2 , R 3 , R 4 , R 5 , R 11 , R 12 , R 13, and R 14 ndependently, is H, a substituted or unsubstituted C 1 -C 6 linear or branched alkyl group, or a substituted or unsubstituted C 5 -C 7 cycloalkyl group, (b) at least one diamine selected from the group consisting of a diamine of Structure (IIb) and a diamine of Structure (IIc): wherein each R 20, independently, is a hydrogen atom, a substituted or unsubstituted C 1 -C 6 linear or branched alkyl group, or a substituted or unsubstituted phenyl group, each R 22, independently, is a substituted or unsubstituted C 1 -C 6 linear or branched alkylene group, R 23 is a substituted or unsubstituted C 1 -C 20 linear or branched alkyl group or a C 6 -C 20 substituted or unsubstituted aryl group, and R 24 is a S atom, —NR 25 —, —CH(R 25 )—, or —(CH 2 ) 2 —, in which R 25 is a C 1 -C 6 substituted or unsubstituted linear or branched alkyl group, (c) at least one tetracarboxylic acid dianhydride, and (d) at least one compound comprising a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. 2. The polymer of claim 1 , wherein component (a) comprises at least one diamine of Structure (Ia). 3. The polymer of claim 2 , wherein the amino group on the indane ring in Structure (Ia) is at the 5 position and the other amino group in Structure (Ia) is at the 4 position. 4. The polymer of claim 3 , wherein each of R 1 , R 2 , and R 3 is CH 3 and each of R 4 and R 5 is H. 5. The polymer of claim 1 , wherein component (b) comprises a diamine of Structure (IIb). 6. The polymer of claim 1 , wherein component (b) comprises a diamine of Structure (IIc). 7. The polymer of claim 1 , wherein the molar ratio of components (a) and (b) to component (c) ranges from 1.01 and 1.4. 8. The polymer of claim 1 , wherein the molar ratio of components (a) and (b) to component (c) ranges from 0.8 and 0.99. 9. A polyamic acid polymer, comprising the reaction product of components (a), (b), (c), and (d), wherein components (a), (b), (c), and (d) are: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib): wherein each of R 1 , R 2 , R 3 , R 4 , R 5 , R 11 , R 12 , R 13 , and R 14 independently, is H, a substituted or unsubstituted C 1 -C 6 linear or branched alkyl group, or a substituted or unsubstituted C 5 -C 7 cycloalkyl group, (b) at least one diamine selected from the group consisting of a diamine of Structure (IIb) and a diamine of Structure (IIc): wherein each R 20 , independently, is a hydrogen atom, a substituted or unsubstituted C 1 -C 6 linear or branched alkyl group, or a substituted or unsubstituted phenyl group, each R 22 , independently, is a substituted or unsubstituted C 1 -C 6 linear or branched alkylene group, R 23 is a substituted or unsubstituted C 1 -C 20 linear or branched alkyl group or a C 5 -C 20 substituted or unsubstituted aryl group, and R 24 is a O or S atom, —NR 25 —, —CH(R 25 )—, or —(CH 3 ) 2 —, in which R 25 is a C 1 -C 6 substituted or unsubstituted linear or branched alkyl group, (c) at least one tetracarboxylic acid dianhydride, and (d) at least one compound comprising a first functional group reactive with an amine or an anhydride and at least a second functional group selected from the group consisting of a substituted or unsubstituted alkenyl group and a substituted or unsubstituted alkynyl group. 10. The polyamic acid polymer of claim 9 , wherein component (b) comprises the diamine of Structure (IIb). 11. The polyamic acid polymer of claim 9 , wherein component (b) comprises the diamine of Structure (IIc). 12. A composition, comprising: (A) at least one polyimide polymer of claim 1 ; (B) at least one reactive functional compound (RFC) having at least one functional group capable of reacting with a substituted or unsubstituted alkenyl group or a substituted or unsubstituted alkynyl group on the polyimide polymer; (C) an initiator capable of initiating a reaction between the substituted or unsubstituted alkenyl group or a substituted or unsubstituted alkynyl group on the polyimide polymer and the RFC; and (D) at least one solvent. 13. The compositions of claim 12 , wherein component (b) comprises a diamine of Structure (IIb). 14. The compositions of claim 13 , wherein component (b) comprises a diamine of Structure (IIc). 15. A process, comprising: coating a substrate with the composition of claim 12 to form a coated substrate having a film on the substrate, and baking the coated substrate to form a coated substrate having a dried film. 16. The process of claim 15 , wherein the coated substrate is baked at a temperature from about 50° C. to about 200° C. 17. The process of claim 16 , further comprising exposing the dried film to radiation through a mask to form a coated substrate having a dried, patternwise exposed film. 18. The process of claim 17 , further comprising baking the dried, patternwise exposed film at a temperature from about 50° C. to about 150° C. in a second baking step. 19. The process of claim 18 , further comprising developing a portion of the dried, exposed film in a developer to produce a relief image on the substrate. 20. The process of claim 19 , further comprising rinsing the relief image on the substrate with a solvent or a mixture of solvents. 21. The process of claim 20 , further comprising baking the substrate having a relief image at a temperature from about 50° C. to about 200° C. in a third baking step. 22. An article formed by a process comprising coating a substrate with the composition of claim 14 to form a coated substrate having a film on the substrate, and baking the coated substrate to form a coated substrate having a dried film, wherein the article is a semiconductor substrate, a flexible film for electronics, a wire isolation, a wire coating, a wire enamel, or an inked substrate. 23. A semiconductor device, comprising the article of claim 22 . 24. The semiconductor device of claim 23 , wherein the semiconductor device is an integrated circuit, a light emitting diode, a solar cell, and a transistor. 25. A dry film structure, comprising a carrier substrate, a protective layer, and a polymeric layer between the carrier substrate and the protective layer, wherein the polymeric layer contains: (A) at least one polyimide polymer of claim 1 ; (B) at least one reactive functional compound (RFC) having at least one functional group capable of reacting with a substituted or unsubstituted alkenyl group or a substitu

Assignees

Inventors

Classifications

  • H10W74/40Primary

    characterised by their materials · CPC title

  • Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound · CPC title

  • Polyimides with diamino moieties or tetracarboxylic segments containing heterocyclic moieties · CPC title

  • Unsaturated polyimide precursors · CPC title

  • Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors · CPC title

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What does patent US11939428B2 cover?
This disclosure relates to a polyimide polymer that includes the reaction product of: (a) at least one diamine selected from the group consisting of a diamine of Structure (Ia) and a diamine of Structure (Ib), (b) at least one diamine of Structure (II), (c) at least one tetracarboxylic acid dianhydride, and optionally (d) at least one compo…
Who is the assignee on this patent?
Fujifilm Electronic Mat Usa Inc
What technology area does this patent fall under?
Primary CPC classification H10W74/40. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 26 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).