Large spot spectral sensing to control spatial setpoints
US-2025298392-A1 · Sep 25, 2025 · US
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Luque Jorge patents
Luque Jorge is listed as an inventor on 27 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Luque Jorge |
| Total patents | 27 |
| First publication | Oct 29, 2015 |
| Latest publication | Sep 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Large spot spectral sensing to control spatial setpoints
US-12360510-B2 · Jul 15, 2025 · US
Metrology Enclosure Including Spectral Reflectometry System for Plasma Processing System Using Direct-Drive Radiofrequency Power Supply
US-2024395519-A1 · Nov 28, 2024 · US
In situ sensor and logic for process control
US-2024255858-A1 · Aug 1, 2024 · US
Machine-learning in multi-step semiconductor fabrication processes
US-2024096713-A1 · Mar 21, 2024 · US
Reflectometer to monitor substrate movement
US-2023420281-A1 · Dec 28, 2023 · US
Reflectometer to monitor substrate movement
US-11791189-B2 · Oct 17, 2023 · US
Large spot spectral sensing to control spatial setpoints
US-2022334554-A1 · Oct 20, 2022 · US
Method and apparatus for determining process rate
US-11056322-B2 · Jul 6, 2021 · US
Reflectometer to monitor substrate movement
US-2020111696-A1 · Apr 9, 2020 · US
Recent patents
Latest publications not already listed above.
Plasma etching systems and methods using empirical mode decomposition
US-10504704-B2 · Dec 10, 2019 · US
System and method for detecting a process point in multi-mode pulse processes
US-10242849-B2 · Mar 26, 2019 · US
Detecting partial unclamping of a substrate from an ESC of a substrate processing system
US-10224187-B1 · Mar 5, 2019 · US
Method and apparatus for real-time monitoring of plasma chamber wall condition
US-10134569-B1 · Nov 20, 2018 · US
Methods for detecting endpoint for through-silicon via reveal applications
US-9941178-B2 · Apr 10, 2018 · US
Method and apparatus for determining process rate
US-2017338160-A1 · Nov 23, 2017 · US
Method and apparatus for determining process rate
US-9735069-B2 · Aug 15, 2017 · US
System and method for detecting a process point in mult-mode pulse processes
US-2017207070-A1 · Jul 20, 2017 · US
System and method for detecting a process point in multi-mode pulse processes
US-9640371-B2 · May 2, 2017 · US
Method and apparatus for determining process rate
US-2017084503-A1 · Mar 23, 2017 · US
Plasma etching systems and methods using empirical mode decomposition
US-2017084433-A1 · Mar 23, 2017 · US
Methods for Detecting Endpoint for Through-Silicon Via Reveal Applications
US-2017062290-A1 · Mar 2, 2017 · US
Plasma etching systems and methods using empirical mode decomposition
US-9548189-B2 · Jan 17, 2017 · US
Systems and methods for detecting endpoint for through-silicon via reveal applications
US-9543225-B2 · Jan 10, 2017 · US
Plasma etching systems and methods using empirical mode decomposition
US-2016314943-A1 · Oct 27, 2016 · US
System and Method for Detecting a Process Point in Multi-Mode Pulse Processes
US-2016111261-A1 · Apr 21, 2016 · US
Systems and methods for detecting endpoint for through-silicon via reveal applications
US-2015311129-A1 · Oct 29, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 27 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P72/0604 | 17 |
| H10P50/242 | 16 |
| H10P74/238 | 12 |
| H10P74/203 | 11 |
| H01L21/67253 | 10 |