Methods for detecting endpoint for through-silicon via reveal applications

Patent metadata

Field	Value
Publication number	US-9941178-B2
Application number	US-201615353305-A
Country	US
Kind code	B2
Filing date	Nov 16, 2016
Priority date	Apr 29, 2014
Publication date	Apr 10, 2018
Grant date	Apr 10, 2018

Abstract

Systems and methods for processing a semiconductor wafer includes a plasma processing chamber. The plasma processing chamber includes an exterior, an interior region with a wafer receiving mechanism and a viewport disposed on a sidewall of the plasma processing chamber providing visual access from the exterior to the wafer received on the wafer receiving mechanism. A camera is mounted to the viewport of the plasma processing chamber on the exterior and coupled to an image processor. The image processor includes pattern recognition logic to match images of emerging pattern captured and transmitted by the camera, to a reference pattern and to generate signal defining an endpoint when a match is detected. A system process controller coupled to the image processor and the plasma processing chamber receives the signal from the image processor and adjusts controls of one or more resources to stop the etching operation.

First claim

What is claimed is:

1. A method for processing a semiconductor wafer, comprising:
detecting the semiconductor wafer received on a wafer receiving mechanism disposed inside a plasma processing chamber;
performing an active etch operation on a top surface of the semiconductor wafer received on the wafer receiving mechanism;
activating a first camera to capture a first set of sequential images of a pattern of conductive features emerging on the top surface of the semiconductor wafer during the active etch operation, the first set of sequential images being captured at an angle that corresponds with an angle at which the first camera is mounted externally at a first viewport defined on a side wall of the plasma processing chamber and oriented below a first transformer-coupled plasma (TCP) window defined on the side wall, wherein the first TCP window is oriented above a top surface of the wafer receiving mechanism, the angle of mount of the first camera providing a side view of the pattern of conductive features emerging during the active etch operation;
transmitting the captured first set of sequential images at regular intervals to an image processor coupled to the first camera, for matching the emerging pattern captured in the first set of sequential images with a reference pattern, wherein the reference pattern used for matching is captured at the angle that matches with the angle at which the first set of sequential images of the emerging pattern are captured; and
generating a signal to suspend the active etch operation, upon detection of a match,
wherein operations of the method are performed by a processor of a host computer.

2. The method of claim 1 , further includes activating an external light source that is coupled to the camera, the external light source used to illuminate the pattern emerging on the semiconductor wafer.

3. The method of claim 1 , wherein the regular intervals for transmitting the first set of sequential images is programmable based on type of feature being defined by the active etch operation.

4. The method of claim 1 , wherein matching the emerging pattern further includes identifying number of features and a height of each feature emerging on the top surface of the semiconductor wafer during the active etch operation, wherein the number of features and the height of the respective features are based on amount of exposure to etchant chemistry.

5. The method of claim 1 , wherein matching the emerging pattern further includes,
determining features and height of each of the features in the emerging pattern captured in an image of the first set of sequential images;
matching the features and the height of each of the features with corresponding features in the reference pattern; and
declaring a match is found when the features and the height of the features in the emerging pattern match with corresponding features in the reference pattern is above a threshold percent.

6. The method of claim 1 , further includes activating a second camera mounted at a second viewport defined on the side wall to capture a second set of sequential images of the pattern emerging on the top surface of the semiconductor wafer, the second set of sequential images capturing a different view angle of the pattern, the second set of sequential images from the second camera together with the first set of sequential images from the first camera are used to determine a three-dimensional attribute of the emerging pattern.

7. The method of claim 6 , wherein the matching includes matching the three-dimensional attribute of the emerging pattern captured in the first set and second set of sequential images by the first camera and the second camera with corresponding three-dimensional attributes of the reference pattern.

8. The method of claim 1 , further includes adjusting one or more etching parameters to control suspension of the active etch operation performed within the plasma processing chamber, in response to the signal.

9. A method for processing a semiconductor wafer, comprising:
detecting the semiconductor wafer received on a wafer receiving mechanism disposed inside a plasma processing chamber;
performing an active etch operation on a top surface of the semiconductor wafer received on the wafer receiving mechanism;
activating a first camera to capture a first set of sequential images of a pattern emerging on the top surface of the semiconductor wafer during the active etch operation, the captured first set of sequential images being transmitted at regular intervals during the active etch operation;
activating a second camera to capture a second set of sequential images of the pattern during the active etch operation, the captured second set of sequential images being transmitted at regular intervals during the active etch operation;
activating a first external light source coupled to the first camera;
activating a second external light source coupled to the second camera, wherein a light pulse from each of the first and the second light sources illuminates the pattern emerging on the top surface of the semiconductor wafer to enable the first and the second cameras to capture the emerging pattern;
matching the emerging pattern captured in the first and the second set of sequential images with a reference pattern; and
generating a signal to suspend the active etch operation, upon detection of a match,
wherein operations of the method are performed by a processor of a host computer.

10. The method of claim 9 , wherein the first set of sequential images are captured at a first angle that corresponds with an angle at which the first camera is mounted externally at a first viewport defined on a side wall of the plasma processing chamber,
wherein the second set of sequential images are captured at a second angle that corresponds with an angle at which the second camera is mounted externally at a second viewport defined on the side wall of the plasma processing chamber.

11. The method of claim 10 , wherein the first viewport is defined substantially opposite to the second viewport.

12. The method of claim 9 , wherein the reference pattern used for matching includes patterns captured at angles that match with the first angle at which the first set of sequential images and the second angle at which the second set of sequential images are captured.

13. The method of claim 9 , wherein the first set of sequential images and the second set of sequential images are used to define a three-dimensional attribute of the emerging pattern, and
wherein the matching of the emerging pattern includes matching the three-dimensional attribute of the emerging pattern with a corresponding three-dimensional attribute of the reference pattern.

14. The method of claim 9 , wherein the regular intervals for transmitting the sequential images is programmable based on type of feature being defined by the active etch operation.

15. The method of claim 9 , wherein matching the emerging pattern further includes,
determining number of features and a height of each feature emerging on the top surface of the semiconductor wafer during the active etch operation; and
matching the number of features and the height of each feature of the emerging pattern with corresponding features in the reference pattern; and
declaring a match is found when the number of features and the height of each of the features in the emerging pattern that match with corresponding features in the reference pattern is above a threshold percent.

16. The method of claim 9 , further includes adjusting one or more etching parameters to control suspensio

Assignees

• Lam Res Corp

Inventors

• Miller Alan Jeffrey
• Sevillano Evelio
• Luque Jorge
• Bailey Iii Andrew D
• Xu Qing

Classifications

• H10W20/0245

  comprising use of blind vias during the manufacture · CPC title

• H10P74/203

  Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P50/242

  of Group IV materials · CPC title

• H10W20/023

  the interconnections being through-semiconductor vias · CPC title