Plasma etching systems and methods using empirical mode decomposition

Patent metadata

Field	Value
Publication number	US-10504704-B2
Application number	US-201615365228-A
Country	US
Kind code	B2
Filing date	Nov 30, 2016
Priority date	Apr 23, 2015
Publication date	Dec 10, 2019
Grant date	Dec 10, 2019

Abstract

A substrate etching system includes an etching control module, a filtering module, and an endpoint module. The etching control module selectively begins plasma etching of a substrate within an etching chamber. The filtering module, during the plasma etching of the substrate: receives a signal including endpoint information; decomposes the signal using empirical mode decomposition (EMD); and generates a filtered signal based on results of the EMD. The endpoint module indicates when an endpoint of the plasma etching of the substrate has been reached based on the filtered signal. The etching control module ends the plasma etching of the substrate in response to the indication that the endpoint of the plasma etching of the substrate has been reached.

First claim

What is claimed is:

1. A substrate etching system, comprising:
an etching control module configured to selectively begin plasma etching of a substrate within an etching chamber;
a filtering module configured to, during the plasma etching of the substrate:
receive a signal including endpoint information;
decompose the signal using empirical mode decomposition (EMD) thereby producing one or more components including endpoint information, one or more components including noise information, and a final residual; and
generate a filtered signal based on the one or more components including endpoint information and the final residual and independent of the one or more components including noise information; and

an endpoint module configured to indicate when an endpoint of the plasma etching of the substrate has been reached based on the filtered signal,
wherein the etching control module is further configured to end the plasma etching of the substrate in response to the indication that the endpoint of the plasma etching of the substrate has been reached.

2. The substrate etching system of claim 1 further comprising a normalization module configured to receive a second signal including endpoint information, to receive a third signal not including endpoint information, to normalize the second signal relative to the third signal to produce the signal including endpoint information, and to output the signal including endpoint information to the filtering module.

3. The substrate etching system of claim 2 wherein the normalization module is configured to select the third signal based on one or more operating parameters of the substrate etching system.

4. The substrate etching system of claim 2 wherein the normalization module is configured to select a confinement ring signal generated by a confinement ring sensor as the third signal when a confinement ring is moving within the etching chamber.

5. The substrate etching system of claim 2 wherein the normalization module is configured to select a power signal indicating a power of the etching chamber as the third signal when a power supply that supplies power to the etching chamber is being tuned.

6. The substrate etching system of claim 2 further comprising:
a first optical emission spectroscopy (OES) sensor configured to generate the second signal based on optical characteristics of plasma within the etching chamber; and
a second OES sensor configured to generate the third signal independent of the plasma within the etching chamber.

7. The substrate etching system of claim 1 further comprising a normalization module configured to normalize a first portion of a second signal relative to a second portion of the second signal to produce the signal including endpoint information and to output the signal including endpoint information to the filtering module,
wherein the first portion of the second signal includes endpoint information, and
wherein the second portion of the second signal does not include endpoint information.

8. The substrate etching system of claim 7 wherein the normalization module is configured to select the second portion of the second signal based on one or more operating parameters of the substrate etching system.

9. The substrate etching system of claim 1 wherein the endpoint module is configured to indicate that the endpoint of the plasma etching of the substrate has been reached when a change in the filtered signal is greater than a predetermined value.

10. The substrate etching system of claim 1 wherein the etching control module is configured to:
open a gas source and actuate a power source to apply power to begin the plasma etching of the substrate; and
close the gas source and actuate the power source to end the plasma etching of the substrate in response to the indication that the endpoint of the plasma etching of the substrate has been reached.

11. A substrate etching system, comprising:
an etching control module configured to selectively begin plasma etching of a substrate within an etching chamber;
a normalization module configured to normalize a first wavelength of a first signal relative to a second wavelength of the first signal to produce a second signal including endpoint information and to output the second signal including endpoint information,
wherein the first wavelength of the first signal includes endpoint information, and
wherein the second wavelength of the first signal does not include endpoint information;
a filtering module configured to, during the plasma etching of the substrate:
receive the second signal including endpoint information;
decompose the second signal using empirical mode decomposition (EMD); and
generate a filtered signal based on results of the EMD; and

an endpoint module configured to indicate when an endpoint of the plasma etching of the substrate has been reached based on the filtered signal,
wherein the etching control module is further configured to end the plasma etching of the substrate in response to the indication that the endpoint of the plasma etching of the substrate has been reached.

12. The substrate etching system of claim 11 further comprising an optical emission spectroscopy (OES) sensor configured to generate the first signal based on optical characteristics of plasma within the etching chamber.

13. The substrate etching system of claim 11 wherein the normalization module is configured to select the second wavelength of the first signal based on one or more operating parameters of the substrate etching system.

14. The substrate etching system of claim 11 wherein the endpoint module is configured to indicate that the endpoint of the plasma etching of the substrate has been reached when a change in the filtered signal is greater than a predetermined value.

15. The substrate etching system of claim 11 wherein the etching control module is configured to:
open a gas source and actuate a power source to apply power to begin the plasma etching of the substrate; and
close the gas source and actuate the power source to end the plasma etching of the substrate in response to the indication that the endpoint of the plasma etching of the substrate has been reached.

Assignees

• Lam Res Corp

Inventors

• Albarede Luc
• Kabouzi Yassine
• Luque Jorge
• Bailey Iii Andrew D

Classifications

• H01J37/32449

  Gas control, e.g. control of the gas flow · CPC title

• H01J37/32972

  Spectral analysis · CPC title

• H01J37/321

  the radio frequency energy being inductively coupled to the plasma · CPC title

• H01J37/32963 Primary

  End-point detection · CPC title

• H01J37/3299

  Feedback systems · CPC title