Semiconductor package having ground bonding wire that crosses over signal bonding wire for crosstalk reduction and associated method
US-2023402818-A1 · Dec 14, 2023 · US
Luo Yan-Bin is listed as an inventor on 34 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Luo Yan-Bin |
| Total patents | 34 |
| First publication | Jan 22, 2015 |
| Latest publication | Dec 14, 2023 |
Publications ranked by popularity score, then publication date.
US-2023402818-A1 · Dec 14, 2023 · US
US-11449453-B2 · Sep 20, 2022 · US
US-2021326292-A1 · Oct 21, 2021 · US
US-10397142-B2 · Aug 27, 2019 · US
US-10083728-B2 · Sep 25, 2018 · US
US-9871539-B2 · Jan 16, 2018 · US
US-9824057-B2 · Nov 21, 2017 · US
US-2017243690-A1 · Aug 24, 2017 · US
US-9665114-B2 · May 30, 2017 · US
US-2017148558-A1 · May 25, 2017 · US
Latest publications not already listed above.
US-9608798-B2 · Mar 28, 2017 · US
US-9590610-B2 · Mar 7, 2017 · US
US-9590595-B2 · Mar 7, 2017 · US
US-2017054656-A1 · Feb 23, 2017 · US
US-9479365-B2 · Oct 25, 2016 · US
US-2016308665-A1 · Oct 20, 2016 · US
US-9473129-B2 · Oct 18, 2016 · US
US-2016246752-A1 · Aug 25, 2016 · US
US-2016204768-A1 · Jul 14, 2016 · US
US-2016197598-A1 · Jul 7, 2016 · US
US-2016191037-A1 · Jun 30, 2016 · US
US-9379921-B2 · Jun 28, 2016 · US
US-9312846-B2 · Apr 12, 2016 · US
US-2016099710-A1 · Apr 7, 2016 · US
US-2016065397-A1 · Mar 3, 2016 · US
US-2016056980-A1 · Feb 25, 2016 · US
US-9246480-B2 · Jan 26, 2016 · US
US-2015349763-A1 · Dec 3, 2015 · US
US-9183340-B2 · Nov 10, 2015 · US
US-9071478-B2 · Jun 30, 2015 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mediatek Inc | 32 |
| Luo Yan-Bin | 2 |
| Chao Kuan-Hua | 1 |
| Mediatek Inc | 1 |
| Airoha Tech Corp | 1 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H03K2005/00052 | 6 |
| H03K3/0322 | 6 |
| H03K2005/00058 | 6 |
| H03K5/131 | 6 |
| H03K19/018585 | 6 |