Dual micro-electro mechanical system and manufacturing method thereof
US-12595167-B2 · Apr 7, 2026 · US
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Liu Chwen-Ming patents
Liu Chwen-Ming is listed as an inventor on 53 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Liu Chwen-Ming |
| Total patents | 53 |
| First publication | Jun 7, 2018 |
| Latest publication | Apr 7, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and methods for forming the same
US-2025294797-A1 · Sep 18, 2025 · US
Method of testing semiconductor package
US-2025174499-A1 · May 29, 2025 · US
Semiconductor device with enhanced thermal dissipation and method for making the same
US-2025087553-A1 · Mar 13, 2025 · US
Method of testing semiconductor package
US-12243788-B2 · Mar 4, 2025 · US
Semiconductor device with enhanced thermal dissipation and method for making the same
US-12183655-B2 · Dec 31, 2024 · US
Semiconductor package and method for making the same
US-2024312851-A1 · Sep 19, 2024 · US
Dual micro-electro mechanical system and manufacturing method thereof
US-2024262681-A1 · Aug 8, 2024 · US
Semiconductor package and method for making the same
US-12027433-B2 · Jul 2, 2024 · US
Dual micro-electro mechanical system and manufacturing method thereof
US-11993512-B2 · May 28, 2024 · US
Recent patents
Latest publications not already listed above.
Inductive device
US-11908884-B2 · Feb 20, 2024 · US
Semiconductor package structure and method for manufacturing the same
US-2024047310-A1 · Feb 8, 2024 · US
Method for detecting defects in semiconductor device
US-11854913-B2 · Dec 26, 2023 · US
Semiconductor package structure and method for manufacturing the same
US-11837526-B2 · Dec 5, 2023 · US
Inductive device
US-2023387182-A1 · Nov 30, 2023 · US
Method of testing semiconductor package
US-2023369139-A1 · Nov 16, 2023 · US
Semiconductor package structure and method for forming the same
US-11804433-B2 · Oct 31, 2023 · US
Semiconductor package
US-11776919-B2 · Oct 3, 2023 · US
Method of testing semiconductor package
US-11769698-B2 · Sep 26, 2023 · US
Semiconductor device and manufacturing method of the same
US-11721597-B2 · Aug 8, 2023 · US
Semiconductor device with enhanced thermal dissipation and method for making the same
US-11626343-B2 · Apr 11, 2023 · US
Semiconductor device and manufacturing method of the same
US-2023064152-A1 · Mar 2, 2023 · US
Method of testing semiconductor package
US-2023019013-A1 · Jan 19, 2023 · US
Semiconductor package structure and method for forming the same
US-2022406705-A1 · Dec 22, 2022 · US
Semiconductor package and method for making the same
US-2022384281-A1 · Dec 1, 2022 · US
Semiconductor package
US-2022375881-A1 · Nov 24, 2022 · US
Semiconductor package structure and method for forming the same
US-2022376034-A1 · Nov 24, 2022 · US
Semiconductor device with enhanced thermal dissipation and method for making the same
US-2022367318-A1 · Nov 17, 2022 · US
Semiconductor package and method for making the same
US-11482461-B2 · Oct 25, 2022 · US
Semiconductor package
US-11450626-B2 · Sep 20, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Taiwan Semiconductor Mfg Co Ltd | 51 |
| Taiwan Semiconductor Mfg Company Ltd | 1 |
| Vanguard Int Semiconduct Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 29 |
| H10W74/117 | 26 |
| H10W90/724 | 18 |
| H10W74/15 | 18 |
| H10W72/877 | 18 |